IDiyas

For the Inventor, By the Inventor

Hsin-Chu, Taiwan

Fu-Jen Li

USPTO Granted Patents = 24

Average Co-Inventor Count = 3.9

ph-index = 5

Forward Citations = 66(Granted Patents)


Company Filing History:

goldMedal24 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2014-2025

where 'Filed Patents' based on already Granted Patents

24 patents (USPTO):
1. 12347817 - Semiconductor device package having warpage control (2025-07-01),
2. 12261125 - Method for forming chip package structure (2025-03-25),
3. 12107038 - Semiconductor packages (2024-10-01),
4. 11978729 - Semiconductor device package having warpage control and method of forming the same (2024-05-07),
5. 11804445 - Method for forming chip package structure (2023-10-31),
6. 11764169 - Semiconductor device package with warpage control structure (2023-09-19),
7. 11600562 - Semiconductor packages and method of manufacturing the same (2023-03-07),
8. 11329006 - Semiconductor device package with warpage control structure (2022-05-10),
9. 11121093 - Methods for selectively forming identification mark on semiconductor wafer (2021-09-14),
10. 11088109 - Packages with multi-thermal interface materials and methods of fabricating the same (2021-08-10),
11. 10685920 - Semiconductor device package with warpage control structure (2020-06-16),
12. 10643951 - Mini identification mark in die-less region of semiconductor wafer (2020-05-05),
13. 10008480 - Package-on-package structure with through molding via (2018-06-26),
14. 9831190 - Semiconductor device package with warpage control structure (2017-11-28),
15. 9780076 - Package-on-package structure with through molding via (2017-10-03),

Title: Innovations in Semiconductor Packaging: The Contributions of Fu-Jen Li

Introduction

Fu-Jen Li, based in Hsin-Chu, Taiwan, is a significant contributor to the field of semiconductor technology with a remarkable portfolio of 22 patents. His inventions focus on enhancing semiconductor packages, a vital component in the ever-evolving electronics industry.

Latest Patents

Li's latest patents showcase his expertise in semiconductor packaging. One notable invention is a semiconductor package that includes an interposer, a die, and a first encapsulant. This innovative design features a protective layer on the die that does not extend beyond its outer sidewall, ensuring efficient functionality. Additionally, his patent on a semiconductor device package emphasizes warpage control, detailing a complex structure where integrated devices are bonded to a substrate with multiple underfill elements and molding layers to enhance performance and reliability.

Career Highlights

Fu-Jen Li has built a distinguished career at Taiwan Semiconductor Manufacturing Company Limited, one of the leading companies in the semiconductor industry. His continuous contributions have not only advanced technology in this sector but also set new standards for semiconductor packaging solutions.

Collaborations

Working alongside talented colleagues such as Ming-Chih Yew and Po-Yao Lin, Li has fostered a collaborative environment that promotes innovation and excellence in semiconductor research and development. Their joint efforts have yielded patents and technologies that are crucial for the advancement of modern electronics.

Conclusion

Through his innovative patents and collaborative spirit, Fu-Jen Li has made significant strides in semiconductor packaging. His work not only highlights the necessity of advanced technology in electronics but also exemplifies the impact of dedicated inventors in shaping the future of this industry.

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