The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2023
Filed:
Oct. 21, 2020
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Shu-Jung Tseng, Taichung County, TW;
Fu-Jen Li, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49861 (2013.01); H01L 21/4846 (2013.01); H01L 21/56 (2013.01); H01L 21/563 (2013.01); H01L 23/3121 (2013.01); H01L 23/49811 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/107 (2013.01);
Abstract
A semiconductor package includes an interposer, a die, a protective layer, a plurality of first electrical connectors and a first molding material. The die includes a first surface and a second surface opposite to the first surface, and the die is bonded to the interposer through the first surface. The protective layer is disposed on the second surface of the die. The first electrical connectors are disposed aside the die. The first molding material is disposed aside the die, the protection layer and the first electrical connectors.