Shu-Jung Tseng

Title: The Innovations of Shu-Jung Tseng

Introduction

Shu-Jung Tseng is a prominent inventor based in Wuci, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 8 patents. His work focuses on enhancing the design and functionality of semiconductor packages, which are crucial components in modern electronics.

Latest Patents

One of his latest patents is titled "Package substrate insulation opening design." This invention describes a semiconductor package that includes a substrate, a first dielectric layer, and bond pads. The design features an opening through the dielectric layer that exposes specific segments of the bond pads, optimizing the package's performance. Another notable patent is related to "Semiconductor packages," which details a package that includes an interposer, a die, and a first encapsulant. This design ensures that the protective layer does not extend beyond the die's outer sidewall, enhancing the overall integrity of the semiconductor package.

Career Highlights

Shu-Jung Tseng works at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His innovative designs have contributed to the advancement of semiconductor technology, making him a valuable asset to his company and the field at large.

Collaborations

Throughout his career, Shu-Jung has collaborated with notable colleagues, including Shyue-Ter Leu and Fu-Jen Li. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Shu-Jung Tseng's contributions to semiconductor technology through his patents and collaborations highlight his role as a key inventor in the industry. His work continues to influence the design and functionality of semiconductor packages, paving the way for future advancements.