The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2024
Filed:
Feb. 01, 2023
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Shu-Jung Tseng, Taichung County, TW;
Fu-Jen Li, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49861 (2013.01); H01L 21/4846 (2013.01); H01L 21/56 (2013.01); H01L 21/563 (2013.01); H01L 23/3121 (2013.01); H01L 23/49811 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/107 (2013.01);
Abstract
A semiconductor package includes an interposer, a die and a first encapsulant. The die is bonded to the interposer, the die has a protective layer thereon, wherein the protective layer and the interposer are disposed on opposite sides of the die, and the protective layer is not extended beyond an outer sidewall of the die. The first encapsulant is disposed aside the die and the protective layer.