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For the Inventor, By the Inventor

Underhill, VT, United States of America

Howard Smith Landis

USPTO Granted Patents = 50 

Average Co-Inventor Count = 2.7

ph-index = 9

Forward Citations = 414(Granted Patents)

DiyaCoin DiyaCoin = 0.41 


Inventors with similar research interests:


Location History:

  • Underhill, VT (US) (1991 - 2015)
  • Essex Junction, VT (US) (2015 - 2019)

Company Filing History:

goldMedal49 out of 164,108 
 
International Business Machines Corporation
 patents
silverMedal1 out of 59 
 
Globalfoundries U.S. 2 LLC
 patents

Years Active: 1991-2019

where 'Filed Patents' based on already Granted Patents

50 patents (USPTO):
1. 10254642 - Modifying design layer of integrated circuit (IC) using nested and non-nested fill objects (2019-04-09),
2. 9977325 - Modifying design layer of integrated circuit (IC) (2018-05-22),
3. 9170482 - Trimming of dummy fill shapes holes to affect near-neighbor dummy fill shapes with built-in optical proximity corrections for semiconductor applications (2015-10-27),
4. 8954901 - Parameter variation improvement (2015-02-10),
5. 8839177 - Method and system allowing for semiconductor design rule optimization (2014-09-16),
6. 8796133 - Optimization metallization for prevention of dielectric cracking under controlled collapse chip connections (2014-08-05),
7. 8739078 - Near-neighbor trimming of dummy fill shapes with built-in optical proximity corrections for semiconductor applications (2014-05-27),
8. 8507346 - Method of forming a semiconductor device having a cut-way hole to expose a portion of a hardmask layer (2013-08-13),
9. 8423945 - Methods and systems to meet technology pattern density requirements of semiconductor fabrication processes (2013-04-16),
10. 8299775 - Current-aligned auto-generated non-equiaxial hole shape for wiring (2012-10-30),
11. 8288821 - SOI (silicon on insulator) substrate improvements (2012-10-16),
12. 8176447 - Formation of masks/reticles having dummy features (2012-05-08),
13. 8138607 - Metal fill structures for reducing parasitic capacitance (2012-03-20),
14. 8089126 - Method and structures for improving substrate loss and linearity in SOI substrates (2012-01-03),
15. 7930667 - System and method of automated wire and via layout optimization description (2011-04-19),

Title: Howard Smith Landis - The Innovative Mind from Underhill

Introduction: Howard Smith Landis, a distinguished inventor hailing from Underhill, VT, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Landis holds several patents in various technological domains, showcasing his versatility and creativity in innovation.

Career Highlights: With a career spanning over two decades, Landis has consistently pushed the boundaries of technology, revolutionizing the industry with his forward-thinking ideas and solutions.

Collaborations: Throughout his career, Landis has collaborated with leading tech companies and research institutions, fostering a culture of innovation and excellence in all his projects.

Conclusion: Howard Smith Landis stands as a beacon of innovation, inspiring future generations of inventors to think outside the box and pursue their creative visions relentlessly.

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