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For the Inventor, By the Inventor

Underhill, VT, United States of America

Howard Smith Landis

USPTO Granted Patents = 50 

Average Co-Inventor Count = 2.7

ph-index = 9

Forward Citations = 414(Granted Patents)

Forward Citations (Not Self Cited) = 392(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Underhill, VT (US) (1991 - 2015)
  • Essex Junction, VT (US) (2015 - 2019)

Company Filing History:

goldMedal49 out of 164,197 
 
International Business Machines Corporation
 patents
silverMedal1 out of 59 
 
Globalfoundries U.S. 2 LLC
 patents

Years Active: 1991-2019

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Areas of Expertise:
Integrated Circuit Design
Optical Proximity Correction
Semiconductor Fabrication
Dummy Fill Structures
Silicon On Insulator
Dielectric Cracking Prevention
Wire Layout Optimization
Pattern Density Requirements
Crack Trapping Techniques
Copper Damascene Migration
Subminimum Feature Planarization
Capacitor Structure Design
50 patents (USPTO):Explore Patents
1. 10254642 - Modifying design layer of integrated circuit (IC) using nested and non-nested fill objects (2019-04-09),
2. 9977325 - Modifying design layer of integrated circuit (IC) (2018-05-22),
3. 9170482 - Trimming of dummy fill shapes holes to affect near-neighbor dummy fill shapes with built-in optical proximity corrections for semiconductor applications (2015-10-27),
4. 8954901 - Parameter variation improvement (2015-02-10),
5. 8839177 - Method and system allowing for semiconductor design rule optimization (2014-09-16),
6. 8796133 - Optimization metallization for prevention of dielectric cracking under controlled collapse chip connections (2014-08-05),
7. 8739078 - Near-neighbor trimming of dummy fill shapes with built-in optical proximity corrections for semiconductor applications (2014-05-27),
8. 8507346 - Method of forming a semiconductor device having a cut-way hole to expose a portion of a hardmask layer (2013-08-13),
9. 8423945 - Methods and systems to meet technology pattern density requirements of semiconductor fabrication processes (2013-04-16),
10. 8299775 - Current-aligned auto-generated non-equiaxial hole shape for wiring (2012-10-30),
11. 8288821 - SOI (silicon on insulator) substrate improvements (2012-10-16),
12. 8176447 - Formation of masks/reticles having dummy features (2012-05-08),
13. 8138607 - Metal fill structures for reducing parasitic capacitance (2012-03-20),
14. 8089126 - Method and structures for improving substrate loss and linearity in SOI substrates (2012-01-03),
15. 7930667 - System and method of automated wire and via layout optimization description (2011-04-19),

Title: Howard Smith Landis - The Innovative Mind from Underhill

Introduction: Howard Smith Landis, a distinguished inventor hailing from Underhill, VT, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Landis holds several patents in various technological domains, showcasing his versatility and creativity in innovation.

Career Highlights: With a career spanning over two decades, Landis has consistently pushed the boundaries of technology, revolutionizing the industry with his forward-thinking ideas and solutions.

Collaborations: Throughout his career, Landis has collaborated with leading tech companies and research institutions, fostering a culture of innovation and excellence in all his projects.

Conclusion: Howard Smith Landis stands as a beacon of innovation, inspiring future generations of inventors to think outside the box and pursue their creative visions relentlessly.

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