The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 2012

Filed:

Dec. 08, 2009
Applicants:

David S. Collins, Williston, VT (US);

Howard S. Landis, Underhill, VT (US);

Anthony K. Stamper, Williston, VT (US);

Janet M. Wilson, Essex Junction, VT (US);

Inventors:

David S. Collins, Williston, VT (US);

Howard S. Landis, Underhill, VT (US);

Anthony K. Stamper, Williston, VT (US);

Janet M. Wilson, Essex Junction, VT (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

Vertically-staggered-level metal fill structures include inner contiguous metal fill structures and outer contiguous metal fill structures. A dielectric material portion is provided between each contiguous metal fill structure. Vertical extent of each contiguous metal fill structure is limited up to three vertically adjoining metal interconnect levels, thereby limiting the capacitance of each contiguous metal fill structure. Capacitive coupling between the contiguous metal fill structures and the metal interconnect structures is minimized due to the fragmented structure of contiguous metal fill structures.


Find Patent Forward Citations

Loading…