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For the Inventor, By the Inventor

Williston, VT, United States of America

David S Collins

USPTO Granted Patents = 31

 

Average Co-Inventor Count = 3.8

ph-index = 6

Forward Citations = 118(Granted Patents)


Company Filing History:

goldMedal31 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 2006-2021

where 'Filed Patents' based on already Granted Patents

31 patents (USPTO):
1. 10978452 - Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry (2021-04-13),
2. 10170476 - Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry (2019-01-01),
3. 9842838 - Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry (2017-12-12),
4. 9397010 - Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry (2016-07-19),
5. 9275997 - Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry (2016-03-01),
6. 8853789 - Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry (2014-10-07),
7. 8674423 - Semiconductor structure having vias and high density capacitors (2014-03-18),
8. 8420518 - Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry (2013-04-16),
9. 8288821 - SOI (silicon on insulator) substrate improvements (2012-10-16),
10. 8288244 - Lateral passive device having dual annular electrodes (2012-10-16),
11. 8234606 - Metal wiring structure for integration with through substrate vias (2012-07-31),
12. 8169007 - Asymmetric junction field effect transistor (2012-05-01),
13. 8138607 - Metal fill structures for reducing parasitic capacitance (2012-03-20),
14. 8125013 - Structure, design structure and method of manufacturing a structure having VIAS and high density capacitors (2012-02-28),
15. 8101494 - Structure, design structure and method of manufacturing a structure having VIAS and high density capacitors (2012-01-24),

Title: David S. Collins: Innovator in Semiconductor Technology

Introduction: David S. Collins is a prominent inventor based in Williston, Vermont, with a remarkable portfolio of 31 patents. His work primarily focuses on semiconductor technology, contributing significantly to advancements in the field. He is currently associated with International Business Machines Corporation (IBM), where he plays a crucial role in innovation.

Latest Patents: Among his latest contributions, David S. Collins holds a noteworthy patent titled “Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry.” This invention outlines a comprehensive method for manufacturing a semiconductor structure, which includes forming a trench in the substrate, depositing a dopant on the trench surfaces, and establishing a shallow trench isolation structure. The patent further details the formation of a deep well in the substrate, along with an N-well and a P-well, culminating in the filling of the trench with conductive material. Such innovations aim to enhance the robustness of semiconductor devices.

Career Highlights: Throughout his illustrious career, David has accumulated a wealth of knowledge and experience in semiconductor manufacturing and design. His extensive work at IBM has positioned him as a leading figure in the domain of CMOS circuitry and latchup robustness. His commitment to refining semiconductor technology is evident through his innovative patents.

Collaborations: David collaborates with notable colleagues such as Steven H. Voldman and Phillip Francis Chapman, who also contribute to the innovative efforts at IBM. Together, they explore new frontiers in semiconductor technology, working on research and development projects that push the boundaries of what is possible in electronics.

Conclusion: David S. Collins exemplifies the spirit of innovation in the semiconductor industry. With a strong patent portfolio and significant contributions to his field, he continues to make strides at IBM, influencing future technologies and processes. His dedication to enhancing semiconductor robustness ensures his legacy as a key inventor in the tech industry.

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