The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2012

Filed:

Jul. 22, 2009
Applicants:

Alan Bernard Botula, Essex Junction, VT (US);

David S. Collins, Williston, VT (US);

Alvin Jose Joseph, Williston, VT (US);

Howard Smith Landis, Underhill, VT (US);

James Albert Slinkman, Montpelier, VT (US);

Anthony K. Stamper, Williston, VT (US);

Inventors:

Alan Bernard Botula, Essex Junction, VT (US);

David S. Collins, Williston, VT (US);

Alvin Jose Joseph, Williston, VT (US);

Howard Smith Landis, Underhill, VT (US);

James Albert Slinkman, Montpelier, VT (US);

Anthony K. Stamper, Williston, VT (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods and structures for improving substrate loss and linearity in SOI substrates. The methods include forming damaged crystal structure regions under the buried oxide layer of SOI substrates and the structures included damaged crystal structure regions under the buried oxide layer of the SOI substrate.


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