The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2013

Filed:

May. 18, 2010
Applicants:

Jeanne P. Bickford, Essex Junction, VT (US);

Allan O. Cruz, Colchester, VT (US);

Michelle Gill, Grand Isle, VT (US);

Howard S. Landis, Underhill, VT (US);

David V. Macdonnell, Ii, Huntington, VT (US);

Donald J. Samuels, Silverthorne, CO (US);

Roger J. Yerdon, Pleasant Valley, NY (US);

Inventors:

Jeanne P. Bickford, Essex Junction, VT (US);

Allan O. Cruz, Colchester, VT (US);

Michelle Gill, Grand Isle, VT (US);

Howard S. Landis, Underhill, VT (US);

David V. MacDonnell, II, Huntington, VT (US);

Donald J. Samuels, Silverthorne, CO (US);

Roger J. Yerdon, Pleasant Valley, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); G06F 9/455 (2006.01);
U.S. Cl.
CPC ...
Abstract

Techniques, systems, and methods are provided for optimizing pattern density fill patterns for integrated circuits. The method includes adjusting an area of a scribe line and a density of dummy fill shapes in the adjusted scribe line, while maintaining an area of the die, to achieve a pattern density associated with technology ground rules for a particular design of the die.


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