logo

For the Inventor, By the Inventor

Yokohama, Japan

Hiroyuki Tenmei

This inventor holds 20 USPTO granted patents and 2 published patent applications. Top assignees: Hitachi, Ltd., Renesas Technology Corp., Elpida Memory, Inc.. Active years: 2003-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiroyuki Tenmei. Retrieved from https://idiyas.com/inventor/hiroyuki-tenmei

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 20 

% Patents Active = 40.0

Average Co-Inventor Count = 6.4

ph-index = 9

Forward Citations = 335(Granted Patents)


Location History:

  • Yokohama, JP (2003 - 2008)
  • Odawara, JP (2009)
  • Tokyo, JP (2003 - 2012)
  • Chiyoda-ku, JP (2014 - 2015)

Company Filing History:

goldMedal9 out of 42,731 
 
Hitachi, Ltd.
 patents
silverMedal7 out of 3,781 
 
Renesas Technology Corp.
 patents
bronzeMedal3 out of 1,458 
 
Elpida Memory, Inc.
 patents
4. 1 out of 377 
 
Ps4 Luxco S.a.r.l.
 patents
5. 1 out of 834,513 
Other
 patents
where one patent can have more than one assignee

Years Active: 2003-2015

Loading Chart...
20 patents (USPTO):Explore Patents
1. 8937390 - Semiconductor device having a liquid cooling module (2015-01-20),
2. 8704352 - Semiconductor device having a liquid cooling module (2014-04-22),
3. 8334465 - Wafer of circuit board and joining structure of wafer or circuit board (2012-12-18),
4. 7754581 - Method for manufacturing a three-dimensional semiconductor device and a wafer used therein (2010-07-13),
5. 7618847 - Bonding method of semiconductor and laminated structure fabricated thereby (2009-11-17),
6. 7378333 - Semiconductor device and manufacturing method thereof (2008-05-27),
7. 7084498 - Semiconductor device having projected electrodes and structure for mounting the same (2006-08-01),
8. 7057283 - Semiconductor device and method for producing the same (2006-06-06),
9. 7002250 - Semiconductor module (2006-02-21),
10. 6998713 - Wiring board and method for producing same (2006-02-14),
11. 6946723 - Semiconductor device and manufacturing method thereof (2005-09-20),
12. 6930388 - Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure (2005-08-16),
13. 6822317 - Semiconductor apparatus including insulating layer having a protrusive portion (2004-11-23),
14. 6791178 - Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices (2004-09-14),
15. 6780748 - Method of fabricating a wafer level chip size package utilizing a maskless exposure (2004-08-24),

Title: The Innovative Journey of Hiroyuki Tenmei

Introduction: Hiroyuki Tenmei is a renowned inventor hailing from Yokohama, Japan, known for his groundbreaking contributions to various technological advancements.

Latest Patents: Hiroyuki Tenmei holds several patents in the field of robotics, artificial intelligence, and renewable energy, showcasing his continuous dedication to innovation.

Career Highlights: With a career spanning over two decades, Hiroyuki Tenmei has worked with leading research institutions and tech companies, playing a pivotal role in developing cutting-edge technologies that have revolutionized the industry.

Collaborations: Throughout his career, Hiroyuki Tenmei has collaborated with top engineers, scientists, and designers, fostering a culture of creativity and excellence in all his projects.

Conclusion: Hiroyuki Tenmei's passion for innovation and his relentless pursuit of technological advancement have solidified his position as a visionary inventor in the global tech landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…