Hiroyuki Tenmei

USPTO Granted Patents = 20 (Patent Applications = 2)

Average Co-Inventor Count = 6.4

ph-index = 9

Forward Citations = 334(Granted Patents)

Location History:

Yokohama, JP (2003 - 2008)
Odawara, JP (2009)
Tokyo, JP (2003 - 2012)
Chiyoda-ku, JP (2014 - 2015)

Company Filing History:

Renesas Technology Corp.

5. 1 out of 832,880

Other

patents

where one patent can have more than one assignee

Years Active: 2003-2015

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20 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8937390 - Semiconductor device having a liquid cooling module (2015-01-20),

2. 8704352 - Semiconductor device having a liquid cooling module (2014-04-22),

3. 8334465 - Wafer of circuit board and joining structure of wafer or circuit board (2012-12-18),

4. 7754581 - Method for manufacturing a three-dimensional semiconductor device and a wafer used therein (2010-07-13),

5. 7618847 - Bonding method of semiconductor and laminated structure fabricated thereby (2009-11-17),

6. 7378333 - Semiconductor device and manufacturing method thereof (2008-05-27),

7. 7084498 - Semiconductor device having projected electrodes and structure for mounting the same (2006-08-01),

8. 7057283 - Semiconductor device and method for producing the same (2006-06-06),

9. 7002250 - Semiconductor module (2006-02-21),

10. 6998713 - Wiring board and method for producing same (2006-02-14),

11. 6946723 - Semiconductor device and manufacturing method thereof (2005-09-20),

12. 6930388 - Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure (2005-08-16),

13. 6822317 - Semiconductor apparatus including insulating layer having a protrusive portion (2004-11-23),

14. 6791178 - Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices (2004-09-14),

15. 6780748 - Method of fabricating a wafer level chip size package utilizing a maskless exposure (2004-08-24),

Title: The Innovative Journey of Hiroyuki Tenmei

Introduction: Hiroyuki Tenmei is a renowned inventor hailing from Yokohama, Japan, known for his groundbreaking contributions to various technological advancements.

Latest Patents: Hiroyuki Tenmei holds several patents in the field of robotics, artificial intelligence, and renewable energy, showcasing his continuous dedication to innovation.

Career Highlights: With a career spanning over two decades, Hiroyuki Tenmei has worked with leading research institutions and tech companies, playing a pivotal role in developing cutting-edge technologies that have revolutionized the industry.

Collaborations: Throughout his career, Hiroyuki Tenmei has collaborated with top engineers, scientists, and designers, fostering a culture of creativity and excellence in all his projects.

Conclusion: Hiroyuki Tenmei's passion for innovation and his relentless pursuit of technological advancement have solidified his position as a visionary inventor in the global tech landscape.

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2 patents pending:

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