The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2006

Filed:

Oct. 17, 2002
Applicants:

Yoshihide Yamaguchi, Fujisawa, JP;

Shigeharu Tsunoda, Fujisawa, JP;

Hiroyuki Tenmei, Yokohama, JP;

Hiroshi Hozoji, Yokohama, JP;

Naoya Kanda, Fujisawa, JP;

Inventors:

Yoshihide Yamaguchi, Fujisawa, JP;

Shigeharu Tsunoda, Fujisawa, JP;

Hiroyuki Tenmei, Yokohama, JP;

Hiroshi Hozoji, Yokohama, JP;

Naoya Kanda, Fujisawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device which includes a semiconductor chip, an insulating film formed on the semiconductor chip, a plurality of projected stress relaxation materials formed on the insulating film, projected electrodes covering at least tops of the stress relaxation materials, and wiring lines for electrically connecting the projected electrodes and element electrodes of the semiconductor chip.


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