Tokyo, Japan

Shigeharu Tsunoda

This inventor holds 31 USPTO granted patents and 1 published patent application and 4 EPO patents, primarily in Semiconductor Manufacturing. Top assignees: Hitachi, Ltd., Hitachi Automotive Systems, Ltd., Renesas Technology Corp.. Active years: 1990-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shigeharu Tsunoda. Retrieved from https://idiyas.com/inventor/shigeharu-tsunoda

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 31 

% Patents Active = 77.4

 

Average Co-Inventor Count = 5.0

ph-index = 11

Forward Citations = 260(Granted Patents)


Location History:

  • Fujisawa, JP (1990 - 2013)
  • Tokyo, JP (2012 - 2023)

Company Filing History:


Years Active: 1990-2023

Loading Chart...
Loading Chart...
Areas of Expertise:
Resin Powder Material
Laser Powder Molding
Powder Layered Modeling
Flow Sensor
Electronic Control Device
Laser Welded Structure
Semiconductor Device
RFID Manufacturing
Wireless Communication Medium
Pipe Module
Encapsulation Methods
Auxiliary Channel
31 patents (USPTO):Explore Patents

Title: The Innovations of Shigeharu Tsunoda: A Pioneer in Resin Powder Technology

Introduction

Shigeharu Tsunoda, based in Tokyo, Japan, is a notable inventor with a remarkable portfolio of 31 patents. His contributions have made significant strides in the field of resin powder materials and advanced modeling techniques.

Latest Patents

Tsunoda's latest innovations include a resin powder material that consists of copolymerized polybutylene terephthalate resin powder combined with an inorganic substance such as fumed silica. This material has a unique composition with an average primary particle diameter of 100 nm or less, used in quantities up to 1.0 wt %. The polybutylene terephthalate resin, which forms the basis of this material, integrates Isophthalic acid in a range of 5 mol % to 15 mol %. The resulting powder features an average particle diameter of 79 micrometers and a maximum particle diameter of 106 micrometers, which is achieved through a grinding process of resin pellets with a viscosity between 0.85 to 1.0 dl/g. His innovations also encompass a powder layered modeling apparatus, designed to create three-dimensional objects using a composite of crystalline resin and filler particles. This apparatus boasts a modeling unit that partitions the modeling space for powder layering, enabled by a dual-directional powder laying unit, and incorporates an energy supply unit for melting or sintering the material powder.

Career Highlights

Throughout his career, Shigeharu Tsunoda has worked with prominent organizations, including Hitachi, Ltd. and Hitachi Automotive Systems, Ltd. His experiences with these corporations have positioned him as an expert in innovative technologies related to materials and modeling.

Collaborations

Tsunoda has collaborated with esteemed professionals in his field, including Satoshi Arai and Naoya Kanda. Their collective expertise has contributed to the advancement of the technology in which they have been involved, fostering innovation and development in resin powder applications.

Conclusion

Shigeharu Tsunoda's innovative spirit and dedication to advancing technology have made him a pivotal figure in the realm of resin powder materials and modeling techniques. With his extensive repertoire of patents, he continues to influence the industry and inspire future advancements in material science.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…