The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2012
Filed:
Jan. 08, 2009
Masahiro Yamaguchi, Tokyo, JP;
Emi Sawayama, Tokyo, JP;
Hiroshi Oyama, Tokyo, JP;
Shigeharu Tsunoda, Tokyo, JP;
Yasuo Amano, Tokyo, JP;
Naoki Matsushima, Tokyo, JP;
Masahiro Yamaguchi, Tokyo, JP;
Emi Sawayama, Tokyo, JP;
Hiroshi Oyama, Tokyo, JP;
Shigeharu Tsunoda, Tokyo, JP;
Yasuo Amano, Tokyo, JP;
Naoki Matsushima, Tokyo, JP;
Elpida Memory, Inc., Tokyo, JP;
Abstract
A semiconductor device includes a semiconductor chip, a first substrate, and a second substrate. The first substrate includes a plurality of wires and a plurality of first electrodes, each first electrode being connected with each wire. The second substrate includes the semiconductor chip that is mounted thereon, and a plurality of second electrodes with, each second electrode being connected with the each first electrode of the first substrate. The widths of the wires of the first substrate are different depending on the lengths of the wires. By changing the widths of the wires depending on their lengths, it is possible to reduce variation in stiffness of the electrodes and vicinities of electrodes, whereby variation in ultrasonic bonding strength can be reduced.