The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2017

Filed:

Jun. 15, 2012
Applicants:

Satoshi Arai, Tokyo, JP;

Shigeharu Tsunoda, Tokyo, JP;

Keiji Hanzawa, Hitachinaka, JP;

Shinobu Tashiro, Hitachinaka, JP;

Inventors:

Satoshi Arai, Tokyo, JP;

Shigeharu Tsunoda, Tokyo, JP;

Keiji Hanzawa, Hitachinaka, JP;

Shinobu Tashiro, Hitachinaka, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01F 15/14 (2006.01); G01F 1/684 (2006.01); G01F 5/00 (2006.01); G01F 15/00 (2006.01); G01F 15/18 (2006.01); B29C 65/00 (2006.01); B32B 37/18 (2006.01); B32B 38/00 (2006.01); B29C 65/78 (2006.01); B29L 31/34 (2006.01); B29C 65/16 (2006.01);
U.S. Cl.
CPC ...
G01F 15/14 (2013.01); B29C 65/1635 (2013.01); B29C 65/7829 (2013.01); B29C 66/232 (2013.01); B29C 66/322 (2013.01); B29C 66/53461 (2013.01); B29C 66/81267 (2013.01); B32B 37/18 (2013.01); B32B 38/0008 (2013.01); G01F 1/6842 (2013.01); G01F 1/6845 (2013.01); G01F 5/00 (2013.01); G01F 15/006 (2013.01); G01F 15/185 (2013.01); B29C 65/1612 (2013.01); B29C 65/1616 (2013.01); B29C 65/1677 (2013.01); B29C 66/30223 (2013.01); B29C 66/542 (2013.01); B29C 66/71 (2013.01); B29C 66/7352 (2013.01); B29C 66/73772 (2013.01); B29C 66/73776 (2013.01); B29C 66/73921 (2013.01); B29C 66/8122 (2013.01); B29C 66/8322 (2013.01); B29K 2995/0027 (2013.01); B29L 2031/3481 (2013.01); B32B 2457/00 (2013.01);
Abstract

A flow sensor includes an auxiliary channel having an opening into which a fluid to be measured is taken; a sensor element that measures the flow of the fluid to be measured; a housing that accommodates electronic parts; and a resin cover. The flow sensor is configured such that junctions of the housing and the cover are formed in locations where first target weld portions, which are formed so that the circuit chamber is surrounded, face each other and second target weld portions, which are disposed for additional reinforcement of the joints, face each other on a bonding face of the housing and a bonding face of the cover with a step being provided. The positioning of the housing and the cover is determined, and the first target weld portions are welded to each other and second target weld portions are welded to each other by way of laser radiation.


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