Hitachi, Ltd.

Hitachi Automotive Systems, Ltd.

Renesas Technology Corp.

Elpida Memory, Inc.

Hitachi Plant Technologies, Ltd.

Shigeharu Tsunoda

Satoshi Arai

Naoya Kanda

Junichi Saeki

Isamu Yoshida

Kunihiko Nishi

Hiroshi Hozoji

Madoka Minagawa

Shinobu Tashiro

Yoshihide Yamaguchi

Hiroyuki Tenmei

Kosuke Inoue

Asao Nishimura

Ichiro Anjoh

Ichiro Anjo

Noriyuki Oroku

Kenji Ujiie

Akira Yajima

Makoto Kitano

Shuji Eguchi

Nae Yoneda

Michiharu Honda

Kenichi Otsuka

Kazuya Ooji

Takeshi Morino

Akihiro Yamaguchi

Aizo Kaneda

Akira Uenodan

Masao Mitani

Masaru Kamoshida

Keiji Hanzawa

Masachika Masuda

Shinya Igarashi

Akio Hasebe

Shozo Nakamura

Sueo Kawai

Naoki Matsushima

Masahiro Yamaguchi

Hiroshi Oyama

Junichi Arita

Ritsuro Orihashi

Kunio Matsumoto

Michifumi Kawai

Yasuo Amano

Hideo Yamakura

Toshikazu Shigyo

Yoshio Oozeki

Ikuo Kawaguchi

Yukio Sakigawa

Shirou Oouchi

Ichiro Miyano

Kazuhiro Sugino

Toshihiro Yasuhara

Shizuo Imaoka

Wataru Sawada

Tooru Yoshida

Taihei Yotsuya

Emi Sawayama

Kenichi Imura

A resin powder material comprising copolymerized polybutylene terephthalate resin powder and an inorganic substance, for example, fumed silica, having an average primary particle diameter of 100 nm or less in an amount up to 1.0 wt %. The polybutylene terephthalate resin comprises from 5 mol % to 15 mol % of Isophthalic acid and has powder with average particles diameter of 79 &#x3bc;m and a maximum particles diameter of 106 &#x3bc;m. Powder is obtained by grinding pellets of the copolymerized polybutylene terephthalate resin having a viscosity of 0.85 to 1.0 dl/g. Powder composition used for production of molded articles by powder laminate molding process.

Resin powder material, laser powder molding method and device

A powder layered modeling apparatus capable of modeling a three-dimensional object using a material powder contains at least a crystalline resin and filler particles. A modeling unit which partitions a modeling space for laying a material powder layer by the material powder to mold the three-dimensional object, a powder laying unit capable of laying the material powder layer in the modeling space by moving the material powder along a first direction with respect to the modeling space, a powder laying unit capable of laying the material powder layer in the modeling space by moving the material powder along a second direction not parallel to the first direction, and an energy supply unit which supplies energy for melting or sintering the material powder to a part constituting a cross-sectional layer to be molded of the three-dimensional object of the material powder layer laid in the modeling space.

Powder layered modeling apparatus

The present invention prevents warp deformation of a molded object formed by laser powder layer laminating molding. There is provided a powder layer laminating molding method including a first step of forming a powder layer which includes powder of a thermoplastic resin, and a second step of sintering the powder layer by irradiating the formed powder layer with a beam having a heating action, in which a molded object is obtained by repeatedly performing the forming and the sintering of the powder layer in the first step and the second step, and an irradiation surface which is irradiated with the beam is divided into a plurality of small regions.

Layer laminating molded object, powder layer laminating molding method, and ridge filter

It is provided an electronic control device including a resin molded body, a metal body, and an electronic component, wherein the resin molded body and a main surface of the metal body are bonded, and at least a part of a side surface continuous to the main surface of the metal body is in contact with a side contact portion provided in the resin molded body.

Electronic control device and method for manufacturing electronic control device

A laser welded structure is formed by laser welding together a resin molded body formed from a thermoplastic polymer alloy containing a crystalline resin and an amorphous resin and a metal body made of a metal. A glass transition temperature of the amorphous resin is lower than a melting start temperature of the crystalline resin.

Laser welded structure, electronic controller and manufacture method for laser welded structure

Provided are a laser-welded structure and a laser welding method for a cover and a housing ensuring high reliability and suppressing changes in characteristics due to burrs protruding into a subpassage of the flow sensor. To this end, this flow sensor is provided with a housing, a cover, a circuit chamber sealed between these and housing electronic components or wiring, and a subpassage through which the fluid flows that is to be sensed, and is characterized in that there are projections provided on both ends of the joining section of the cover where the housing and the cover are laser-welded, and the height of the projection on the subpassage side is greater than the height of the projection on the side opposite of the subpassage.

Flow sensor and manufacturing method thereof

The purpose of the present invention is to provide a flow sensor that makes it possible to detect temperature abnormalities that the flow sensor has been exposed to and the time history of the flow sensor in a high-temperature environment from an externally visible cover material and that uses a cover material for which the laser welding quality can be guaranteed through visual inspection when the sensor is delivered as a product and even if the sensor is used in an abnormal state. A flow sensor provided with a housing, a cover, a circuit chamber that houses a wiring portion sealed between the housing and the cover, and an auxiliary passage through which the liquid to be sensed flows, wherein: a joint portion formed on the housing and a joint portion formed on the inner surface of the cover are joined together through the laser welding; the main material of the cover is a crystalline resin; the cover includes an amorphous alloy; and the cover is made to have a natural color.

Flow sensor and method for producing resin structure

Provided is a low-cost flow sensor which improves productivity while maintaining high quality and high reliability. This flow sensor is provided with a housing, a cover, a circuit chamber sealed between these and housing electronic components or wiring, and a subpassage through which the fluid flows that is to be detected, and is characterized in that the welding width of a first welded portion forming the circuit chamber is greater than the welding width of a part of the second welded portion forming the subpassage unit.

Flow sensor

Provided is a welding structure which enables external visual checks and has improved stability of bonding properties at a laser weld between a cover and a housing of this flow sensor. This flow sensor is provided with a housing, a cover, a circuit chamber sealed between these and housing electronic components or wiring, and a subpassage through which the fluid flows that is to be sensed, and is characterized in that at least the part near the gate section of the cover that transmits the laser is thinner than the other parts that transmit the laser.

A flow sensor includes an auxiliary channel having an opening into which a fluid to be measured is taken; a sensor element that measures the flow of the fluid to be measured; a housing that accommodates electronic parts; and a resin cover. The flow sensor is configured such that junctions of the housing and the cover are formed in locations where first target weld portions, which are formed so that the circuit chamber is surrounded, face each other and second target weld portions, which are disposed for additional reinforcement of the joints, face each other on a bonding face of the housing and a bonding face of the cover with a step being provided. The positioning of the housing and the cover is determined, and the first target weld portions are welded to each other and second target weld portions are welded to each other by way of laser radiation.

Flow sensor with a housing that accommodates an auxiliary channel having an opening into which a fluid to be measured is taken

A flow rate sensor includes: a housing made from a resin material and having a bottom base portion and a side wall, at least one surface side of the housing being open; a cover made from a resin material, covering the one surface side of the housing, welded to an upper surface of the side wall of the housing, and defining, with the bottom base portion and the side wall of the housing, an auxiliary passage within which a gas to be measured flows that is taken in from a main passage; and a flow rate detection unit disposed within the auxiliary passage. A protruding portion for height control is provided to one of the housing and the cover at least in a vicinity of the side wall around the flow rate detection unit so as to suppress sinking in of the cover during welding.

Flow sensor with a protruding portion for height control and a cover for suppressing sinking of the cover during welding

A temporary part is fixed to a base by using an adhesive layer to which fillers are mixed at a predetermined density. When the temporary part is heated, heat is applied to the fillers and the adhesive layer. At a temperature equal to or higher than the glass-transition temperature of the adhesive agent, the heated adhesive layer is thermally contracted so as to release remaining stress, and on the other hand, the heated fillers are thermally expanded. In this manner, the peel-off strength between the adhesive layer and the base (or the temporary part) is reduced, and the disassembly is facilitated.

Pipe module

A semiconductor device includes a semiconductor chip, a first substrate, and a second substrate. The first substrate includes a plurality of wires and a plurality of first electrodes, each first electrode being connected with each wire. The second substrate includes the semiconductor chip that is mounted thereon, and a plurality of second electrodes with, each second electrode being connected with the each first electrode of the first substrate. The widths of the wires of the first substrate are different depending on the lengths of the wires. By changing the widths of the wires depending on their lengths, it is possible to reduce variation in stiffness of the electrodes and vicinities of electrodes, whereby variation in ultrasonic bonding strength can be reduced.

Semiconductor device including first substrate having plurality of wires and a plurality of first electrodes and a second substrate including a semiconductor chip being mounted thereon, and second electrodes connected with first electrodes of first substrate

The present invention aims to improve the durability of an RFID chip inlet. A module including an RFID chip amounted to an antenna is covered with polyimide film with an adhesive layer to make up an RFID inlet. The outer surface of the RFID inlet is then covered with the surface processed to increase surface lubricity of a base part. When the RFID inlet is for use in a rubber product, it is mounted to a rubber base of the rubber product, the exposed surface of the RFID inlet is covered with an unvulcanized rubber, and the unvulcanized rubber is then pressed and heated causing the RFID inlet to be embedded in the rubber base.

Electronic device, rubber product, and methods for manufacturing the same

A highly reliable inexpensive RFID medium (Radio-frequency Identification medium) and a method of manufacturing the same is provided, particularly for small, thin RFID mediums. A RFID medium includes a transmitting/receiving antennaand an IC chipA rectangular part of a base sheethaving a major surface on which transmitting/receiving antennasare formed, is folded along one of the long sides thereof, and the other three sides are bonded to the base sheetso as to cover the transmitting/receiving antennaand the IC chipconnected to the transmitting/receiving antennaThe base sheethas spacing parts of a predetermined shape for covering the transmitting/receiving antennaand the IC chipconnected to the transmitting/receiving antennaThe transmitting/receiving antennasand the spacing partsare arranged alternately. The base sheetis rolled in a roll.

Wireless communication medium and method of manufacturing the same

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Tokyo, Japan

Shigeharu Tsunoda