The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2019

Filed:

Sep. 29, 2015
Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;

Inventors:

Satoshi Arai, Tokyo, JP;

Shigeharu Tsunoda, Tokyo, JP;

Wataru Sawada, Tokyo, JP;

Masaru Kamoshida, Hitachinaka, JP;

Toshikazu Shigyo, Hitachinaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/16 (2006.01); B29C 65/82 (2006.01); B29C 65/00 (2006.01); B29C 65/44 (2006.01); B29C 65/18 (2006.01); B23K 26/324 (2014.01); H05K 5/06 (2006.01); B23K 26/21 (2014.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 65/1635 (2013.01); B23K 26/21 (2015.10); B23K 26/324 (2013.01); B29C 65/1606 (2013.01); B29C 65/1616 (2013.01); B29C 65/1629 (2013.01); B29C 65/1638 (2013.01); B29C 65/1654 (2013.01); B29C 65/1661 (2013.01); B29C 65/1677 (2013.01); B29C 65/44 (2013.01); B29C 65/8215 (2013.01); B29C 65/8223 (2013.01); B29C 66/028 (2013.01); B29C 66/112 (2013.01); B29C 66/114 (2013.01); B29C 66/1122 (2013.01); B29C 66/1142 (2013.01); B29C 66/124 (2013.01); B29C 66/1222 (2013.01); B29C 66/1224 (2013.01); B29C 66/244 (2013.01); B29C 66/43 (2013.01); B29C 66/5346 (2013.01); B29C 66/71 (2013.01); B29C 66/7212 (2013.01); B29C 66/72143 (2013.01); B29C 66/7392 (2013.01); B29C 66/73115 (2013.01); B29C 66/73117 (2013.01); B29C 66/73161 (2013.01); B29C 66/73521 (2013.01); B29C 66/73771 (2013.01); B29C 66/73775 (2013.01); B29C 66/73921 (2013.01); B29C 66/73941 (2013.01); B29C 66/742 (2013.01); B29C 66/7422 (2013.01); B29C 66/8322 (2013.01); B29C 66/9592 (2013.01); H05K 5/06 (2013.01); B29C 65/18 (2013.01); B29C 66/026 (2013.01); B29C 66/02245 (2013.01); B29C 66/74283 (2013.01); B29C 66/8122 (2013.01); B29C 66/81267 (2013.01); B29L 2031/3481 (2013.01);
Abstract

A laser welded structure is formed by laser welding together a resin molded body formed from a thermoplastic polymer alloy containing a crystalline resin and an amorphous resin and a metal body made of a metal. A glass transition temperature of the amorphous resin is lower than a melting start temperature of the crystalline resin.


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