The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2020
Filed:
Oct. 07, 2016
Applicant:
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;
Inventors:
Satoshi Arai, Tokyo, JP;
Yukio Sakigawa, Tokyo, JP;
Shigeharu Tsunoda, Tokyo, JP;
Masaru Kamoshida, Hitachinaka, JP;
Shirou Oouchi, Hitachinaka, JP;
Assignee:
Hitachi Automotive Systems, Ltd., Ibaraki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 5/06 (2006.01); B29C 65/44 (2006.01); B29C 65/82 (2006.01); B29C 65/00 (2006.01); B29C 65/16 (2006.01); H05K 5/00 (2006.01); H05K 7/20 (2006.01); B29L 31/34 (2006.01); B29K 701/12 (2006.01); H05K 5/02 (2006.01);
U.S. Cl.
CPC ...
H05K 5/065 (2013.01); B29C 65/16 (2013.01); B29C 65/44 (2013.01); B29C 65/8223 (2013.01); B29C 66/026 (2013.01); B29C 66/028 (2013.01); B29C 66/1248 (2013.01); B29C 66/742 (2013.01); H05K 5/0017 (2013.01); H05K 7/2039 (2013.01); H05K 7/20854 (2013.01); B29K 2701/12 (2013.01); B29L 2031/3481 (2013.01); H05K 5/0247 (2013.01);
Abstract
It is provided an electronic control device including a resin molded body, a metal body, and an electronic component, wherein the resin molded body and a main surface of the metal body are bonded, and at least a part of a side surface continuous to the main surface of the metal body is in contact with a side contact portion provided in the resin molded body.