The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2020
Filed:
Jan. 26, 2018
Applicant:
Hitachi, Ltd., Chiyoda-ku, Tokyo, JP;
Inventors:
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/153 (2017.01); B29C 64/393 (2017.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); B33Y 50/02 (2015.01); A61N 5/10 (2006.01); B29L 11/00 (2006.01);
U.S. Cl.
CPC ...
B29C 64/153 (2017.08); B29C 64/393 (2017.08); A61N 5/10 (2013.01); A61N 2005/1095 (2013.01); B29L 2011/0066 (2013.01); B33Y 10/00 (2014.12); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12);
Abstract
The present invention prevents warp deformation of a molded object formed by laser powder layer laminating molding. There is provided a powder layer laminating molding method including a first step of forming a powder layer which includes powder of a thermoplastic resin, and a second step of sintering the powder layer by irradiating the formed powder layer with a beam having a heating action, in which a molded object is obtained by repeatedly performing the forming and the sintering of the powder layer in the first step and the second step, and an irradiation surface which is irradiated with the beam is divided into a plurality of small regions.