The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2006
Filed:
Aug. 16, 2001
Hiroshi Hozoji, Yokohama, JP;
Yoshihide Yamaguchi, Fujisawa, JP;
Naoya Kanda, Fujisawa, JP;
Shigeharu Tunoda, Fujisawa, JP;
Hiroyuki Tenmei, Yokohama, JP;
Hiroshi Hozoji, Yokohama, JP;
Yoshihide Yamaguchi, Fujisawa, JP;
Naoya Kanda, Fujisawa, JP;
Shigeharu Tunoda, Fujisawa, JP;
Hiroyuki Tenmei, Yokohama, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A semiconductor module, comprising a wiring substrate on which wiring is formed, a semiconductor device electrically connected to the wiring formed on the wiring substrate, and an external connection terminal arranged on the semiconductor device mounted side of the wiring substrate so as to be a connected portion between the wiring and the outside electrically connected thereto, wherein there is formed an insulating resin layer thicker than the semiconductor device between the wiring substrate and the external connection terminal.