The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2004
Filed:
Jul. 30, 2002
Applicant:
Inventors:
Yoshihide Yamaguchi, Fujisawa, JP;
Hiroyuki Tenmei, Yokohama, JP;
Hiroshi Hozoji, Hitachiota, JP;
Naoya Kanda, Fujisawa, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01R 4/316 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01R 4/316 ;
Abstract
In the re-wiring formation process of a WLCSP, at least some of the re-wiring lines that connect the bonding pads and bump pads of the semiconductor chips are formed using a photolithographic process that does not use a photomask. In this re-wiring formation process, standard portions are formed by development following photomask exposure, and portions that are to be designed corresponding to customer specifications are subjected to additional development following additional maskless exposure in the final stage.