The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2005

Filed:

Mar. 16, 2001
Applicants:

Toshiya Satoh, Kanasagou-machi, JP;

Masahiko Ogino, Hitachi, JP;

Tadanori Segawa, Hitachi, JP;

Yoshihide Yamaguchi, Fujisawa, JP;

Hiroyuki Tenmei, Yokohama, JP;

Atsushi Kazama, Chiyoda-machi, JP;

Ichiro Anjo, Koganei, JP;

Asao Nishimura, Kokubunji, JP;

Inventors:

Toshiya Satoh, Kanasagou-machi, JP;

Masahiko Ogino, Hitachi, JP;

Tadanori Segawa, Hitachi, JP;

Yoshihide Yamaguchi, Fujisawa, JP;

Hiroyuki Tenmei, Yokohama, JP;

Atsushi Kazama, Chiyoda-machi, JP;

Ichiro Anjo, Koganei, JP;

Asao Nishimura, Kokubunji, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L023/495 ;
U.S. Cl.
CPC ...
Abstract

A semiconductor device having a semiconductor element is obtained by cutting a semiconductor wafer, having an electrode pad formed on one side thereof, along a scribe line. The semiconductor device has a semiconductor element protective layer on the semiconductor element so as to form an opening above the pad, a stress cushioning layer on the layer so as to form an opening on the pad, a lead wire portion reaching the layer from the electrode pad via the openings, external electrodes on the lead wire portion, and a conductor protective layer on the layer. The layer, the layer, and the conductor protective layer form respective end faces on the end surface of the semiconductor element inside the scribe line and expose a surface of the semiconductor element from the end face of the end surface to a point inside of the scribe line, thereby to expose the scribe line.


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