The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2014
Filed:
Jan. 06, 2010
Nae Hisano, Chiyoda-ku, JP;
Shigeo Ohashi, Chiyoda-ku, JP;
Yasuo Osone, Chiyoda-ku, JP;
Yasuhiro Naka, Chiyoda-ku, JP;
Hiroyuki Tenmei, Chiyoda-ku, JP;
Kunihiko Nishi, Chiyoda-ku, JP;
Hiroaki Ikeda, Chuo-ku, JP;
Masakazu Ishino, Chuo-ku, JP;
Hideharu Miyake, Chuo-ku, JP;
Shiro Uchiyama, Chuo-ku, JP;
Nae Hisano, Chiyoda-ku, JP;
Shigeo Ohashi, Chiyoda-ku, JP;
Yasuo Osone, Chiyoda-ku, JP;
Yasuhiro Naka, Chiyoda-ku, JP;
Hiroyuki Tenmei, Chiyoda-ku, JP;
Kunihiko Nishi, Chiyoda-ku, JP;
Hiroaki Ikeda, Chuo-ku, JP;
Masakazu Ishino, Chuo-ku, JP;
Hideharu Miyake, Chuo-ku, JP;
Shiro Uchiyama, Chuo-ku, JP;
Other;
Abstract
A semiconductor device comprises a mounting substrate, a semiconductor element provided above said mounting substrate, a package substrate provided above said mounting substrate with said semiconductor element therebetween and electrically connected to said semiconductor element via a primary connecting bump, a liquid cooling module cooling said semiconductor element by a liquid refrigerant, in which a heat receiving section of the liquid cooling module is disposed between said semiconductor element and said mounting substrate, and a plurality of secondary connecting bumps provided between said package substrate and said mounting substrate.