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For the Inventor, By the Inventor

Tokyo, Japan

Shigeo Ohashi

This inventor holds 7 USPTO granted patents. Top assignees: Ps4 Luxco S.a.r.l., Other. Active years: 1976-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shigeo Ohashi. Retrieved from https://idiyas.com/inventor/shigeo-ohashi-95a10nnj

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 7

% Patents Active = 71.4

Average Co-Inventor Count = 1.3

ph-index = 5

Forward Citations = 172(Granted Patents)


Location History:

  • Oto, Tokyo, JA (1976)
  • Ota, Tokyo, JA (1977)
  • Setagaya-ku, Tokyo, JP (1981 - 1982)
  • Setgaya-ku, Tokyo, JP (1993)
  • Chiyoda-ku, JP (2014 - 2015)

Company Filing History:

goldMedal1 out of 377 
 
Ps4 Luxco S.a.r.l.
 patents
silverMedal6 out of 834,601 
Other
 patents

Years Active: 1976-2015

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7 patents (USPTO):Explore Patents
1. 8937390 - Semiconductor device having a liquid cooling module (2015-01-20),
2. 8704352 - Semiconductor device having a liquid cooling module (2014-04-22),
3. 5253493 - Washing machine having a sink (1993-10-19),
4. 4313041 - Small switch (1982-01-26),
5. 4292615 - Switching element (1981-09-29),
6. 4063055 - Switch with an on-off indicating mechanism (1977-12-13),
7. 3996441 - Switch with rocker actuator having detachable cover (1976-12-07),

Title: Innovations of Shigeo Ohashi in Semiconductor Technology

Introduction

Shigeo Ohashi, an innovative inventor based in Chiyoda-ku, Japan, has made significant contributions to the field of semiconductor technology. With a total of seven patents to his name, Ohashi has been instrumental in developing advanced solutions that enhance the performance and efficiency of semiconductor devices.

Latest Patents

Among his latest innovations is a groundbreaking semiconductor device featuring a liquid cooling module. This invention comprises a mounting substrate with a semiconductor element positioned above it. A package substrate also lies above the mounting substrate, with the semiconductor element sandwiched in between and electrically connected via a primary connecting bump. The liquid cooling module effectively cools the semiconductor element using a liquid refrigerant. Notably, the heat receiving section of this cooling module is strategically placed between the semiconductor element and the mounting substrate, supported by multiple secondary connecting bumps linking the package substrate to the mounting substrate.

Career Highlights

Throughout his career, Shigeo Ohashi has worked with notable companies in the tech industry, such as Ps4 Luxco S.A.R.L. His expertise and innovative mindset have allowed him to develop and patent valuable technologies that contribute to advancements in semiconductor applications.

Collaborations

Ohashi has partnered with talented individuals in the industry, including Nae Hisano and Yasuo Osone. Together, they have shared ideas and collaborated on developing new technologies that push the boundaries of semiconductor engineering.

Conclusion

Shigeo Ohashi's innovations in semiconductor technology exemplify his commitment to advancing the field. With his extensive experience and valuable patents, he continues to influence the industry and inspire future inventors in the realm of semiconductor devices. His contributions will undoubtedly play a critical role in shaping the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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