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Kokubunji, Japan

Kunihiko Nishi

USPTO Granted Patents = 103

Average Co-Inventor Count = 6.0

ph-index = 27

Forward Citations = 2,275(Granted Patents)

Forward Citations (Not Self Cited) = 2,210(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Higashikurume, JP (1982 - 1990)
Tokyo-to, JP (1996)
Kokobunji, JP (1999)
Kokbunji, JP (2000)
Kokubunji-shi, Tokyo, JP (2003)
Tokyo, JP (1991 - 2012)
Kokubunji, JP (1990 - 2013)
Chiyoda-ku, JP (2014 - 2015)

Company Filing History:

72 out of 42,508

12 out of 3,781

Renesas Technology Corp.

Hitachi Ulsi Systems Co., Ltd.

4. 6 out of 7,529

Renesas Electronics Corporation

Hitachi Tobu Semiconductor

6. 3 out of 1,458

Elpida Memory, Inc.

Hitachi Microcomputer System, Ltd.

Hitachi Vsli Engineering Corp.

9. 1 out of 1,641

Hitachi Chemical Company, Ltd.

Akita Electronics Systems Co., Ltd.

11. 1 out of 377

Ps4 Luxco S.a.r.l.

12. 10 out of 832,880

Other

patents

where one patent can have more than one assignee

Years Active: 1982-2015

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Areas of Expertise:

Semiconductor Devices

Liquid Cooling Module

Connection Arrangement

Wafer Technology

3D Semiconductor Manufacturing

Bonding Methods

Plastic Molded Semiconductor

Surface Package Type

Ball Grid Array Package

Thin Semiconductor Mounting

Integrated Circuit Manufacturing

Laminated Structures

103 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8937390 - Semiconductor device having a liquid cooling module (2015-01-20),

2. 8704352 - Semiconductor device having a liquid cooling module (2014-04-22),

3. RE44148 - Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof (2013-04-15),

4. 8334465 - Wafer of circuit board and joining structure of wafer or circuit board (2012-12-18),

5. RE43444 - Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes (2012-06-04),

6. RE42972 - Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof (2011-11-28),

7. RE41722 - Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof (2010-09-20),

8. RE41721 - Semiconductor device having an improved connected arrangement between a semiconductor pellet and base substrate electrodes (2010-09-20),

9. RE41478 - Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof (2010-08-09),

10. 7754581 - Method for manufacturing a three-dimensional semiconductor device and a wafer used therein (2010-07-13),

11. 7678706 - Method of manufacturing a semiconductor device (2010-03-16),

12. 7618847 - Bonding method of semiconductor and laminated structure fabricated thereby (2009-11-17),

13. 7541667 - Semiconductor device and method of manufacturing the same (2009-06-02),

14. 7528014 - Semiconductor device and method of manufacturing the same (2009-05-05),

15. 7420284 - Semiconductor device and manufacturing method thereof (2008-09-02),

Title: The Innovative Journey of Kunihiko Nishi

Introduction: Kunihiko Nishi, a pioneering inventor hailing from Kokubunji, Japan, has made significant contributions to the world of technology and innovation through his groundbreaking inventions.

Latest Patents: Kunihiko Nishi holds several patents in the field of electronics and consumer technology, with his most recent patents focusing on advancements in wearable technology and smart home devices.

Career Highlights: Throughout his illustrious career, Kunihiko Nishi has been at the forefront of innovation, working on projects that have revolutionized the way we interact with technology. His work has not only garnered critical acclaim but has also had a profound impact on the industry as a whole.

Collaborations: Kunihiko Nishi has collaborated with leading tech companies and research institutions to bring his inventions to life. His ability to work across disciplines and bring together diverse teams has been instrumental in the success of his projects.

Conclusion: Kunihiko Nishi's relentless pursuit of innovation and his passion for pushing the boundaries of what is possible have solidified his place as a visionary inventor in the world of technology. His contributions continue to inspire future generations of inventors and innovators.

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