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For the Inventor, By the Inventor

Kokubunji, Japan

Kunihiko Nishi

This inventor holds 103 USPTO granted patents, primarily in Semiconductor Devices (CPC class 257666). Top assignees: Hitachi, Ltd., Renesas Technology Corp., Hitachi Ulsi Systems Co., Ltd.. Active years: 1982-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kunihiko Nishi. Retrieved from https://idiyas.com/inventor/kunihiko-nishi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 103

% Patents Active = 81.6

Average Co-Inventor Count = 6.0

ph-index = 27

Forward Citations = 2,282(Granted Patents)

Forward Citations (Not Self Cited) = 2,210(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Higashikurume, JP (1982 - 1990)
  • Tokyo-to, JP (1996)
  • Kokobunji, JP (1999)
  • Kokbunji, JP (2000)
  • Kokubunji-shi, Tokyo, JP (2003)
  • Tokyo, JP (1991 - 2012)
  • Kokubunji, JP (1990 - 2013)
  • Chiyoda-ku, JP (2014 - 2015)

Company Filing History:

goldMedal72 out of 42,731 
 
Hitachi, Ltd.
 patents
silverMedal12 out of 3,781 
 
Renesas Technology Corp.
 patents
bronzeMedal7 out of 336 
 
Hitachi Ulsi Systems Co., Ltd.
 patents
4. 6 out of 7,654 
 
Renesas Electronics Corporation
 patents
5. 4 out of 30 
 
Hitachi Tobu Semiconductor
 patents
6. 3 out of 1,458 
 
Elpida Memory, Inc.
 patents
7. 3 out of 64 
 
Hitachi Microcomputer System, Ltd.
 patents
8. 1 out of 8 
 
Akita Electronics Systems Co., Ltd.
 patents
9. 1 out of 1,641 
 
Hitachi Chemical Company, Ltd.
 patents
10. 1 out of 182 
 
Hitachi Vlsi Engineering Corp.
 patents
11. 1 out of 377 
 
Ps4 Luxco S.a.r.l.
 patents
12. 10 out of 834,513 
Other
 patents
where one patent can have more than one assignee

Years Active: 1982-2015

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Areas of Expertise:
Liquid Cooling Module
Connection Arrangement
Manufacturing Method
Three-Dimensional Device
Wafer Structure
Plastic Molded Device
Surface Package
Ball Grid Array
Semiconductor Memory
Integrated Circuit
Laminated Structure
Thin Semiconductor
103 patents (USPTO):Explore Patents
1. 8937390 - Semiconductor device having a liquid cooling module (2015-01-20),
2. 8704352 - Semiconductor device having a liquid cooling module (2014-04-22),
3. RE44148 - Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof (2013-04-15),
4. 8334465 - Wafer of circuit board and joining structure of wafer or circuit board (2012-12-18),
5. RE43444 - Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes (2012-06-04),
6. RE42972 - Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof (2011-11-28),
7. RE41722 - Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof (2010-09-20),
8. RE41721 - Semiconductor device having an improved connected arrangement between a semiconductor pellet and base substrate electrodes (2010-09-20),
9. RE41478 - Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof (2010-08-09),
10. 7754581 - Method for manufacturing a three-dimensional semiconductor device and a wafer used therein (2010-07-13),
11. 7678706 - Method of manufacturing a semiconductor device (2010-03-16),
12. 7618847 - Bonding method of semiconductor and laminated structure fabricated thereby (2009-11-17),
13. 7541667 - Semiconductor device and method of manufacturing the same (2009-06-02),
14. 7528014 - Semiconductor device and method of manufacturing the same (2009-05-05),
15. 7420284 - Semiconductor device and manufacturing method thereof (2008-09-02),

Title: The Innovative Journey of Kunihiko Nishi

Introduction: Kunihiko Nishi, a pioneering inventor hailing from Kokubunji, Japan, has made significant contributions to the world of technology and innovation through his groundbreaking inventions.

Latest Patents: Kunihiko Nishi holds several patents in the field of electronics and consumer technology, with his most recent patents focusing on advancements in wearable technology and smart home devices.

Career Highlights: Throughout his illustrious career, Kunihiko Nishi has been at the forefront of innovation, working on projects that have revolutionized the way we interact with technology. His work has not only garnered critical acclaim but has also had a profound impact on the industry as a whole.

Collaborations: Kunihiko Nishi has collaborated with leading tech companies and research institutions to bring his inventions to life. His ability to work across disciplines and bring together diverse teams has been instrumental in the success of his projects.

Conclusion: Kunihiko Nishi's relentless pursuit of innovation and his passion for pushing the boundaries of what is possible have solidified his place as a visionary inventor in the world of technology. His contributions continue to inspire future generations of inventors and innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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