The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2009
Filed:
Apr. 07, 2005
Yoshinori Miyaki, Tachikawa, JP;
Hiromichi Suzuki, Tokyo, JP;
Kazunari Suzuki, Tokyo, JP;
Kunihiko Nishi, Kokubunji, JP;
Yoshinori Miyaki, Tachikawa, JP;
Hiromichi Suzuki, Tokyo, JP;
Kazunari Suzuki, Tokyo, JP;
Kunihiko Nishi, Kokubunji, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A manufacturing method of a semiconductor device including preparing a lead frame having a die pad, leads arranged around the die pad and a silver plating layer formed over a first portion of each of the leads, mounting a semiconductor chip over a main surface of the die pad with a rear surface of the chip fixed to the main surface of the die pad, electrically connecting electrodes of the chip with the leads through wires, forming a molding resin sealing the die pad, the first portion, the semiconductor chip, and the wires, and forming a lead-free solder plating layer over a second portion of each of the leads exposed from the molding resin. An area of the die pad is smaller than an area of the chip, and a part of the molding resin contacts with the rear surface of the chip exposed from the die pad.