Masakazu Ishino

USPTO Granted Patents = 20 (Patent Applications = 1)

Average Co-Inventor Count = 3.8

ph-index = 10

Forward Citations = 256(Granted Patents)

Location History:

Yokohama, JP (1993 - 2009)
Chuo-ku, JP (2009 - 2014)
Tokyo, JP (2009 - 2015)

Company Filing History:

4. 1 out of 832,680

Other

patents

where one patent can have more than one assignee

Years Active: 1993-2015

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20 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8937390 - Semiconductor device having a liquid cooling module (2015-01-20),

2. 8704352 - Semiconductor device having a liquid cooling module (2014-04-22),

3. 8513121 - Semiconductor memory device and manufacturing method thereof (2013-08-20),

4. 8334465 - Wafer of circuit board and joining structure of wafer or circuit board (2012-12-18),

5. 8298940 - Semiconductor memory device and manufacturing method thereof (2012-10-30),

6. 7893540 - Semiconductor memory device and manufacturing method thereof (2011-02-22),

7. 7791196 - Semiconductor device having a smaller electrostatic capacitance electrode (2010-09-07),

8. 7754581 - Method for manufacturing a three-dimensional semiconductor device and a wafer used therein (2010-07-13),

9. 7638362 - Memory module with improved mechanical strength of chips (2009-12-29),

10. 7618847 - Bonding method of semiconductor and laminated structure fabricated thereby (2009-11-17),

11. 7576433 - Semiconductor memory device and manufacturing method thereof (2009-08-18),

12. 7564127 - Memory module that is capable of controlling input/output in accordance with type of memory chip (2009-07-21),

13. 6137185 - Electrode structure of a wiring substrate of semiconductor device having (2000-10-24),

14. 5939789 - Multilayer substrates methods for manufacturing multilayer substrates (1999-08-17),

15. 5886409 - Electrode structure of wiring substrate of semiconductor device having (1999-03-23),

Masakazu Ishino: A Pioneer in Semiconductor Device Innovations

Introduction

Masakazu Ishino, based in Tokyo, Japan, is an accomplished inventor and engineer recognized for his significant contributions to the field of semiconductor technology. With a remarkable portfolio of 20 patents, Ishino has made noteworthy advancements that enhance the efficiency and cooling capabilities of semiconductor devices.

Latest Patents

Ishino's recent innovation, titled "Semiconductor Device Having a Liquid Cooling Module," showcases a sophisticated design that integrates a liquid cooling system into semiconductor architecture. This invention includes a mounting substrate, a semiconductor element placed above, and a package substrate connected via primary connecting bumps. The innovative liquid cooling module effectively cools the semiconductor element through a liquid refrigerant, optimizing performance and heat management. Such advancements have the potential to revolutionize cooling techniques in semiconductor applications.

Career Highlights

Throughout his career, Masakazu Ishino has worked with notable companies in the technology sector, including Elpida Memory, Inc. and Hitachi, Ltd. His tenure at these companies has allowed him to collaborate on various projects, further driving the development of advanced semiconductor technologies.

Collaborations

Throughout his journey, Ishino has had the privilege to work alongside talented individuals, including Hiroaki Ikeda and Yasuhiro Naka. These collaborations have fostered a creative environment that promotes innovation and excellence in their shared pursuit of technological advancement.

Conclusion

Masakazu Ishino's contributions to semiconductor technology through his patents and collaborations underscore his status as an influential figure in the field. As the industry continues to evolve, his innovative approaches to device cooling and efficiency pave the way for future advancements in semiconductor systems.

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