The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 1999
Filed:
Jul. 16, 1997
Michifumi Kawai, Tokyo, JP;
Ryohei Satoh, Yokohama, JP;
Osamu Yamada, Hiratsuka, JP;
Eiji Matsuda, Yokohama, JP;
Masakazu Ishino, Yokohama, JP;
Takashi Inoue, Yokohama, JP;
Hideo Sotokawa, Yokohama, JP;
Masayuki Kyoui, Yokohama, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A multilayer substrate which is fabricated by laminating a plurality of substrates, each comprising an insulation film, a plurality of via holes which pass through the upper surface to the lower surface of the insulation film, a wiring which is provided on the upper surface of the insulation film and the upper surface of the via holes and electrically connected with the via holes, a bonding member which is provided on the lower surfaces of the via holes and electrically connected with the via holes, and a bonding layer which is provided on the upper surface of the insulation film where the wiring is formed and the method of fabrication thereof whereby large costs reduction and high density effect can be obtained.