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For the Inventor, By the Inventor

Newburgh, NY, United States of America

Erdem Kaltalioglu

USPTO Granted Patents = 74 

 

Average Co-Inventor Count = 3.4

ph-index = 13

Forward Citations = 591(Granted Patents)

DiyaCoin DiyaCoin = 0.59 


Inventors with similar research interests:


Location History:

  • Wappinger Falls, NY (US) (2006)
  • Hopewell Junction, NY (US) (2007)
  • Fishkill, NY (US) (2005 - 2009)
  • Wappingers Falls, NY (US) (2001 - 2010)
  • Hsin-Chu, TW (2004 - 2010)
  • Iselin, NJ (US) (2016)
  • Newburgh, NY (US) (2007 - 2020)

Company Filing History:

goldMedal43 out of 14,705 
 
Infineon Technologies Ag
 patents
silverMedal24 out of 164,108 
 
International Business Machines Corporation
 patents
bronzeMedal12 out of 5,671 
 
Globalfoundries Inc.
 patents
4. 1 out of 244 
 
Infineon Technologies North America Corp.
 patents
5. 1 out of 4 
 
United Microelectronics Co.
 patents
6. 2 out of 832,680 
Other
 patents
where one patent can have more than one assignee

Years Active: 2001-2020

where 'Filed Patents' based on already Granted Patents

74 patents (USPTO):
1. 10770407 - IC structure with interdigitated conductive elements between metal guard structures (2020-09-08),
2. 10438890 - Interconnect structure having power rail structure and related method (2019-10-08),
3. 10388617 - Mechanically anchored C4 pad and method of forming same (2019-08-20),
4. 10325862 - Wafer rigidity with reinforcement structure (2019-06-18),
5. 10304783 - Wafer reinforcement to reduce wafer curvature (2019-05-28),
6. 10297546 - Interconnect structures for a security application (2019-05-21),
7. 9997456 - Interconnect structure having power rail structure and related method (2018-06-12),
8. 9947602 - IC structure integrity sensor having interdigitated conductive elements (2018-04-17),
9. 9852999 - Wafer reinforcement to reduce wafer curvature (2017-12-26),
10. 9768065 - Interconnect structures with variable dopant levels (2017-09-19),
11. 9761539 - Wafer rigidity with reinforcement structure (2017-09-12),
12. 9741657 - TSV deep trench capacitor and anti-fuse structure (2017-08-22),
13. 9553054 - Strain detection structures for bonded wafers and chips (2017-01-24),
14. 9536779 - Selective local metal cap layer formation for improved electromigration behavior (2017-01-03),
15. 9524916 - Structures and methods for determining TDDB reliability at reduced spacings using the structures (2016-12-20),

Title: Erdem Kaltalioglu: Pioneering Innovations in Newburgh, NY

Introduction:

Erdem Kaltalioglu, a prolific inventor based in Newburgh, NY, has made significant contributions to the field of integrated circuits and semiconductor technologies. With an impressive portfolio of 74 patents, Erdem is renowned for his groundbreaking work in IC structures and interconnect technologies.

Latest Patents:

Erdem's latest patents showcase his expertise in developing cutting-edge IC structures. One notable patent is the "IC structure with interdigitated conductive elements between metal guard structures," which features a sophisticated design for enhancing circuit performance and reliability. Another groundbreaking invention is the "Interconnect structure having power rail structure and related method," which revolutionizes the way power distribution is handled in ICs.

Career Highlights:

Throughout his career, Erdem has worked with esteemed companies such as Infineon Technologies AG and IBM (International Business Machines Corporation). His tenure at these industry giants has provided him with invaluable experience and insights into the latest technological advancements in the semiconductor industry.

Collaborations:

Erdem has collaborated with industry experts such as Ping-Chuan Wang and Ronald G Filippi, showcasing his ability to work effectively in team environments and leverage collective expertise to drive innovation forward. These collaborations have played a crucial role in shaping Erdem's success as a pioneering inventor.

Conclusion:

In conclusion, Erdem Kaltalioglu stands as a leading figure in the realm of semiconductor innovations, with a remarkable track record of patents and technological breakthroughs. His contributions have not only advanced the field of integrated circuits but have also inspired a new generation of inventors to push the boundaries of what is possible in the world of semiconductor technology.

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