The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2016

Filed:

Oct. 31, 2012
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Ronald G. Filippi, Wappingers Falls, NY (US);

Erdem Kaltalioglu, Newburgh, NY (US);

Naftali E. Lustig, Croton on Hudson, NY (US);

Ping-Chuan Wang, Hopewell Junction, NY (US);

Lijuan Zhang, Beacon, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
H01L 22/34 (2013.01); G01R 31/2884 (2013.01); H01L 2224/45099 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15311 (2013.01);
Abstract

A structure for TDDB measurement, a method determining TDDB at reduced spacings. The structure includes an upper dielectric layer on a top surface of a lower dielectric layer, a bottom surface of the upper dielectric layer and the top surface of the lower dielectric layer defining an interface; a first wire formed in the lower dielectric layer; a second wire formed in the upper dielectric layer; and wherein a distance between the first wire and the second wire measured in a direction parallel to the interface is below the lithographic resolution limit of the fabrication technology.


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