Wappingers Falls, NY, United States of America

Ronald G Filippi

This inventor holds 101 USPTO granted patents and 3 published patent applications and 1 EPO patent, primarily in Interconnect Structures (CPC class H01L2924-0002). Top assignees: International Business Machines Corporation, Globalfoundries Inc., Advanced Micro Devices Corporation. Active years: 1999-2019.

USPTO Granted Patents = 101 

% Patents Active = 47.5


Average Co-Inventor Count = 5.4

ph-index = 14

Forward Citations = 856(Granted Patents)

Forward Citations (Not Self Cited) = 802(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Wappinger Falls, NY (US) (2002 - 2013)
  • Hopewell Junction, NY (US) (2012 - 2014)
  • Wappingers Fall, NY (US) (2014 - 2016)
  • Wappingers Falls, NY (US) (1999 - 2019)

Company Filing History:


Years Active: 1999-2019

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Areas of Expertise:
Wafer Rigidity
Electromigration
Interconnect Reliability
Back-End Fuse
TSV Structures
Damascene Feature
Graphene-Metal Interconnects
Metal Fuse
Thermal Cycle Reliability
Stacked Via Structure
Selective Metal Cap Layer
Subtractive Etch
101 patents (USPTO):Explore Patents

As an AI assistant at idiyas.com, I'll be delighted to provide you with an article about inventor Ronald G Filippi.

Title: Inventor Spotlight: Ronald G Filippi

Introduction:

Ronald G Filippi, a prolific inventor based in Wappingers Falls, NY, has made significant contributions to the field of technology with his innovative patents. With a remarkable total of 101 patents to his name, Filippi continues to push the boundaries of technological advancement.

Latest Patents:

1. Wafer rigidity with reinforcement structure: Filippi's latest patent involves the use of reinforcement structures with a thinned wafer, enhancing its rigidity. The method includes forming trenches or vias through a backside of a thinned wafer attached to a carrier wafer, depositing material within the trenches to create reinforcement structures, and removing excess material to refine the wafer's surface.

2. Interconnect structure with subtractive etch feature: Another recent patent by Filippi focuses on forming an interconnect structure by depositing a first conductive material on a substrate, etching the material to create a patterned conductive layer, and depositing a dielectric layer to enhance the structure.

Career Highlights:

Throughout his illustrious career, Filippi has worked with renowned companies such as IBM and Globalfoundries Inc. His expertise and dedication have played a pivotal role in driving technological advancements within these organizations.

Collaborations:

Filippi has collaborated with notable coworkers such as Ping-Chuan Wang and Andrew Herbert Simon, contributing to a rich and diverse exchange of ideas in the realm of technological innovation.

Conclusion:

In conclusion, Ronald G Filippi stands as a beacon of innovation in the field of technology, with a remarkable portfolio of patents that showcase his ingenuity and dedication to advancing the industry. His collaboration with esteemed colleagues and work with leading companies underscores his significant impact on the world of invention and innovation.

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