The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

Oct. 01, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Junjing Bao, San Diego, CA (US);

Griselda Bonilla, Fishkill, NY (US);

Kaushik Chanda, San Jose, CA (US);

Samuel S. Choi, Beacon, NY (US);

Ronald G. Filippi, Wappingers Falls, NY (US);

Stephan Grunow, Saratoga, NY (US);

Naftali E. Lustig, Croton on Hudson, NY (US);

Dan Moy, Bethel, CT (US);

Andrew H. Simon, Fishkill, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/525 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01H 85/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5256 (2013.01); H01L 21/76805 (2013.01); H01L 21/76807 (2013.01); H01L 21/76811 (2013.01); H01L 21/76816 (2013.01); H01L 23/5226 (2013.01); H01H 2085/0275 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A BEOL e-fuse is disclosed which reliably blows in the via and can be formed even in the tightest pitch BEOL layers. The BEOL e-fuse can be formed utilizing a line first dual damascene process to create a sub-lithographic via to be the programmable link of the e-fuse. The sub-lithographic via can be patterned using standard lithography and the cross section of the via can be tuned to match the target programming current.


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