For the Inventor, By the Inventor

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Hsin-chu, Taiwan

United Microelectronics Co.

USPTO Granted Patents = 4

Forward Citations = 8

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11 inventors (with patents filed for the assignee):

Pak Leung (2 out of 8 patents)

Sebastian Schmidt (2 out of 23 patents)

Hang Yip Liu (2 out of 6 patents)

4. Benjamin Szu-Min Lin (2 out of 49 patents)

5. Hans-Joachim Barth (1 out of 88 patents)

6. Erdem Kaltalioglu (1 out of 74 patents)

7. Mark Hoinkis (1 out of 27 patents)

8. Ernst H Demm (1 out of 6 patents)

9. Alexander M Hirsch (1 out of 3 patents)

10. Gerald R Friese (1 out of 13 patents)

11. Robert C Wong (1 out of 89 patents)

4 patents: Sort by Forward Citations

1. 8229062 - Transmission mask with differential attenuation to improve ISO-dense proximity (2012-07-24),

2. 7875544 - Method of producing a semiconductor interconnect architecture including generation of metal holes by via mutation (2011-01-25),

3. 7052808 - Transmission mask with differential attenuation to improve ISO-dense proximity (2006-05-30),

4. 6960835 - Stress-relief layer for semiconductor applications (2005-11-01),

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USPTO Data Jan 1 1976 - Dec 23 2025

4 Patents

#50 in Hsin-chu

#2,619 in Taiwan

Hsin-chu, Taiwan

United Microelectronics Co.

Forward Citations = 8

11 inventors:

Pak Leung (2 out of 8 patents)

Sebastian Schmidt (2 out of 23 patents)

Hang Yip Liu (2 out of 6 patents)

4. Benjamin Szu-Min Lin (2 out of 49 patents)

5. Hans-Joachim Barth (1 out of 88 patents)

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