Alexander M Hirsch

Title: The Innovations of Alexander M Hirsch

Introduction

Alexander M Hirsch is a notable inventor based in Munich, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on improving semiconductor interconnect architectures, which are crucial for the performance and reliability of electronic devices.

Latest Patents

Hirsch's latest patents include innovative methods for the generation of metal holes by via mutation. One of his patents describes a semiconductor interconnect architecture that reduces the intersection of vias on the last layer ('VL') and holes in the last thin metal layer ('MLHOLE'). This reduction is achieved without degrading product yield or robustness, nor increasing copper dishing. The mutation of some dense redundant VLs to MLHOLEs effectively decreases the number of intersections between VLs and MLHOLEs. Another patent outlines a method of producing a semiconductor interconnect architecture that achieves similar results, emphasizing the importance of maintaining product quality while enhancing design efficiency.

Career Highlights

Throughout his career, Alexander M Hirsch has worked with prominent companies in the technology sector. He has been associated with IBM and Infineon Technologies AG, where he has contributed to various projects that advance semiconductor technology. His expertise in this field has made him a valuable asset to these organizations.

Collaborations

Hirsch has collaborated with several notable professionals in his field, including Robert C Wong and Ernst H Demm. These collaborations have likely enriched his work and contributed to the innovative solutions he has developed.

Conclusion

Alexander M Hirsch is a distinguished inventor whose work in semiconductor technology has led to significant advancements in the industry. His patents reflect a commitment to innovation and quality, making him a key figure in the field.