The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2007
Filed:
Nov. 06, 2003
Applicants:
Robert C. Wong, Poughkeepsie, NY (US);
Ernst H. Demm, Putnam Valley, NY (US);
Pak Leung, Cedar Park, TX (US);
Alexander M. Hirsch, Munich, DE;
Inventors:
Robert C. Wong, Poughkeepsie, NY (US);
Ernst H. Demm, Putnam Valley, NY (US);
Pak Leung, Cedar Park, TX (US);
Alexander M. Hirsch, Munich, DE;
Assignees:
International Business Machines Corporation, San Jose, CA (US);
Infineon Technologies North America Corp., Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
Abstract
A reduction in the intersection of vias on the last layer ('VL') and holes in the last thin metal layer ('MLHOLE') can be achieved without degrading product yield or robustness or increasing copper dishing. The mutation of some dense redundant VLs to MLHOLEs decreases the number of intersections between VLs and MLHOLEs.