The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2013
Filed:
Dec. 13, 2010
Robert C. Wong, Poughkeepsie, NY (US);
Ernst H. Demm, Putnam Valley, NY (US);
Pak Leung, Cedar Park, TX (US);
Alexander M. Hirsch, Munich, DE;
Robert C. Wong, Poughkeepsie, NY (US);
Ernst H. Demm, Putnam Valley, NY (US);
Pak Leung, Cedar Park, TX (US);
Alexander M. Hirsch, Munich, DE;
Infineon Technologies AG, Munich, DE;
International Business Machines Corporation, Armonk, NY (US);
United Mircroelectronics Co., Hsin-chu, TW;
Abstract
A semiconductor interconnect architecture provides a reduction in the intersection of vias on the last layer ('VL') and holes in the last thin metal layer ('MLHOLE') without degradation of the product yield or robustness, or increases copper dishing. The mutation of some dense redundant VLs to MLHOLEs decreases the number of intersections between VLs and MLHOLEs.