The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2017

Filed:

Oct. 02, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Erdem Kaltalioglu, Newburgh, NY (US);

Andrew T. Kim, Poughkeepsie, NY (US);

Chengwen Pei, Danbury, CT (US);

Ping-Chuan Wang, Hopewell Junction, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 21/762 (2006.01); H01L 21/308 (2006.01); H01L 21/3105 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/308 (2013.01); H01L 21/31051 (2013.01); H01L 21/76283 (2013.01); H01L 29/0649 (2013.01); H01L 29/66795 (2013.01);
Abstract

A semiconductor structure includes filled dual reinforcing trenches that reduce curvature of the semiconductor structure by stiffening the semiconductor structure. The filled dual reinforcing trenches reduce curvature by acting against transverse loading, axial loading, and/or torsional loading of the semiconductor structure that would otherwise result in semiconductor structure curvature. The filled dual reinforcing trenches may be located in an array throughout the semiconductor structure, in particular locations within the semiconductor structure, or at the perimeter of the semiconductor structure.


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