The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2020

Filed:

Jan. 04, 2019
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Zhuojie Wu, Port Chester, NY (US);

Cathryn J. Christiansen, Richmond, VT (US);

Erdem Kaltalioglu, Newburgh, NY (US);

Ping-Chuan Wang, Hopewell Junction, NY (US);

Ronald G. Filippi, Jr., Wappingers Falls, NY (US);

Eric D. Hunt-Schroeder, Essex Junction, VT (US);

Nicholas A. Polomoff, Irvine, CA (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/538 (2006.01); G01N 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); G01N 27/121 (2013.01); H01L 23/5386 (2013.01); H01L 23/564 (2013.01);
Abstract

An integrated circuit (IC) structure includes a back end of line (BEOL) stack on a substrate, the BEOL stack having a plurality of metal layers therein and a plurality of inter-level dielectric (ILD) layers therein. The plurality of metal layers includes a lowermost metal layer and an uppermost metal layer. A pair of metal guard structures proximate a perimeter of the BEOL stack concentrically surrounds the active circuitry. Each metal guard structure includes a continuous metal fill between the lowermost metal layer and the uppermost metal layer of the plurality of metal layers. A set of interdigitating conductive elements within one of the plurality of metal layers includes a first plurality of conductive elements electrically coupled to one of the pair of metal guard structures interdigitating with a second plurality of conductive elements electrically coupled to the other of the pair of metal guard structures.


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