Dwight Lee Daniels

Title: The Innovations of Dwight Lee Daniels

Introduction

Dwight Lee Daniels is a prominent inventor based in Phoenix, AZ, known for his significant contributions to the field of electronics. With a total of 16 patents to his name, he has made remarkable advancements in electronic device substrates and semiconductor technologies.

Latest Patents

One of his latest patents is for a technology titled "Patterned and planarized under-bump metallization." This invention provides an electronic device substrate with a substantially planar surface made from an electrically non-conductive material. The substrate features one or more metalized pads that are coplanar with the surrounding non-conductive material. The metalized pads are designed with metalized fingers that extend radially in an interdigitated arrangement, ensuring a solderable surface. Another notable patent is for "Grounding lids in integrated circuit devices." This invention includes a semiconductor device with a substrate, an IC die, and a conductive lid that is attached over the IC die. The design incorporates an electrical ground path and a conductive structure that connects the lid to the ground path, enhancing the device's functionality.

Career Highlights

Throughout his career, Dwight has worked with leading companies in the semiconductor industry, including Freescale Semiconductor, Inc. and NXP USA, Inc. His work has significantly impacted the development of advanced electronic components and systems.

Collaborations

Dwight has collaborated with notable professionals in the field, including Stephen Ryan Hooper and Alan J. Magnus. These collaborations have contributed to the innovation and refinement of his inventions.

Conclusion

Dwight Lee Daniels continues to be a driving force in the field of electronics through his innovative patents and collaborations. His work not only advances technology but also sets a foundation for future developments in the industry.