The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2021
Filed:
Jun. 19, 2019
Applicant:
Nxp Usa, Inc., Austin, TX (US);
Inventors:
Dwight Lee Daniels, Phoenix, AZ (US);
Stephen Ryan Hooper, Mesa, AZ (US);
Michael B. Vincent, Chandler, AZ (US);
Assignee:
NXP USA, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/04 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 21/78 (2006.01); H01L 25/065 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3121 (2013.01); H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/04 (2013.01); H01L 23/315 (2013.01); H01L 23/4952 (2013.01); H01L 23/49838 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48177 (2013.01);
Abstract
A semiconductor device includes a substrate, an IC die mounted on the substrate, packaging encapsulant on the substrate, a cavity in the packaging encapsulant, a conductive lid attached to the packaging encapsulant over the IC die, an electrical ground path in the substrate, and a first conductive structure in the cavity. The first conductive structure includes a first end electrically coupled to the conductive lid and a second end electrically coupled to the electrical ground path.