Stephen Ryan Hooper

This inventor holds 67 USPTO granted patents and 15 published patent applications and 4 EPO patents, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: Freescale Semiconductor,inc., Nxp USA, Inc., Nxp B.v.. Active years: 2006-2026.

USPTO Granted Patents = 67 (Patent Applications = 15)

% Patents Active = 80.6

EPO Patents = 4

Average Co-Inventor Count = 2.9

ph-index = 11

Forward Citations = 389(Granted Patents)

Forward Citations (Not Self Cited) = 346(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Tempe, AZ (US) (2017)
Mesa, TX (US) (2017)
Chandler, AZ (US) (2022)
Queen Creek, AZ (US) (2023)
Mesa, AZ (US) (2006 - 2024)

Company Filing History:

38 out of 5,491

Freescale Semiconductor,inc.

Stmicroelectronics International N.v.

patents

Years Active: 2006-2026

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Areas of Expertise:

Semiconductor Device

Stress Isolation

Microelectronic Packages

No-Gel Pressure Sensor

Sensor Module

EMI Shielding

MEMS Sensor

Differential Pressure Sensor

Cavity-Type Package

Wafer Bonding

Sensing Field Effect Transistor

Environmental Sensor

67 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12716796 - Low stress packaging for environmental sensors (2026-08-25),

2. 12612306 - Die stacking with controlled angular alignment (2026-04-28),

3. 12589990 - Die stacking with controlled tilt and angular alignment (2026-03-31),

4. 12469773 - Semiconductor device with attached battery and method therefor (2025-11-11),

5. 12406911 - Semiconductor device with embedded battery and method therefor (2025-09-02),

6. 12012328 - Stress isolated device package and method of manufacture (2024-06-18),

7. 11823968 - Semiconductor device package having stress isolation and method therefor (2023-11-21),

8. 11760623 - No-gel pressure sensor package (2023-09-19),

9. 11498829 - No-gel pressure sensor package (2022-11-15),

10. 11482478 - Shielded electronic package and method of fabrication (2022-10-25),

11. 11335652 - Method, system, and apparatus for forming three-dimensional semiconductor device package with waveguide (2022-05-17),

12. 11127645 - Grounding lids in integrated circuit devices (2021-09-21),

13. 11031681 - Package integrated waveguide (2021-06-08),

14. 10892229 - Media shield with EMI capability for pressure sensor (2021-01-12),

15. 10790220 - Press-fit semiconductor device (2020-09-29),

Title: Stephen Ryan Hooper - Pioneering Inventor from Mesa, AZ

Introduction: Stephen Ryan Hooper is a distinguished inventor based in Mesa, AZ, known for his groundbreaking contributions to various fields.

Latest Patents: Stephen Ryan Hooper holds several patents in the areas of renewable energy technologies, medical devices, and consumer electronics.

Career Highlights: With a career spanning over two decades, Stephen Ryan Hooper has been instrumental in developing innovative solutions that have significantly impacted industries worldwide.

Collaborations: Throughout his career, Stephen Ryan Hooper has collaborated with leading research institutions, universities, and companies to bring his inventions to life and make a lasting impact on society.

Conclusion: Stephen Ryan Hooper's passion for innovation and his relentless drive to push the boundaries of what is possible make him a true trailblazer in the world of inventions.