The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 2021
Filed:
Jun. 20, 2019
Nxp Usa, Inc., Austin, TX (US);
Michael B. Vincent, Chandler, AZ (US);
Scott M. Hayes, Chandler, AZ (US);
Zhiwei Gong, Chandler, AZ (US);
Stephen Ryan Hooper, Mesa, AZ (US);
Pascal Oberndorff, Nijmegen, NL;
Walter Parmon, Chandler, AZ (US);
NXP USA, INC., Austin, TX (US);
Abstract
A method of manufacturing a packaged semiconductor device is provided. The method includes attaching a semiconductor die to a package substrate. A bond pad of the semiconductor die is coupled to an antenna radiator formed on the package substrate. A waveguide is attached to the package substrate. An opening of the waveguide includes sidewalls substantially surrounding the antenna radiator. An epoxy material is deposited over at least a portion of the package substrate while leaving the opening void of epoxy material.