Nijmegen, Netherlands

Pascal Oberndorff

USPTO Granted Patents = 1 

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Pascal Oberndorff: Pioneering Innovations in Semiconductor Packaging

Introduction: Pascal Oberndorff, based in Nijmegen, Netherlands, is a distinguished inventor known for his contribution to the field of semiconductor packaging. With a focused expertise in integrated waveguide technology, he holds a patent that showcases innovative methods of manufacturing packaged semiconductor devices.

Latest Patents: Oberndorff's notable patent is titled "Package integrated waveguide." This invention presents a method for creating a packaged semiconductor device, highlighting the intricate process of attaching a semiconductor die to a package substrate. This method includes coupling a bond pad of the semiconductor die to an antenna radiator formed on the substrate, along with the attachment of a waveguide. The design ensures that the opening of the waveguide includes sidewalls that substantially surround the antenna radiator, and an epoxy material is strategically deposited over the substrate, leaving the opening void of epoxy to maintain functionality.

Career Highlights: Pascal Oberndorff has made significant strides in his career as an inventor at NXP USA, Inc., a leading global semiconductor company. His role involves consistent collaboration with other talented professionals in the industry, which drives innovation and enhances the development of advanced technology products.

Collaborations: Throughout his career, Oberndorff has worked closely with colleagues such as Michael B Vincent and Scott M Hayes. These collaborations represent the teamwork essential in the innovation process, allowing for a sharing of ideas and expertise that propel their projects forward.

Conclusion: As an inventor, Pascal Oberndorff exemplifies the spirit of innovation within the semiconductor industry. His patent on package integrated waveguide technology not only signifies his individual achievements but also reflects the collaborative efforts within NXP USA, Inc. His work continues to inspire and pave the way for future advancements in semiconductor device manufacturing.

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