Freescale Semiconductor,inc.

Nxp Usa, Inc.

Nxp B.v.

Stephen Ryan Hooper

Philip H Bowles

William G McDonald

Dwight Lee Daniels

Michael B Vincent

Chad S Dawson

Raymond Mervin Roop

Scott M Hayes

James MacDonald

Mark Edward Schlarmann

Chayathorn Saklang

Paige M Holm

Alan J Magnus

Chanon Suwankasab

Darrel R Frear

Amornthep Saiyajitara

Justin Eugene Poarch

Dubravka Bilic

Arvind S Salian

Patrice M Parris

Zhiwei Gong

Fengyuan Li

Bernd Offermann

William C Stermer, Jr

Thomas Cobb Speight

Chunlin C Xia

David E Heeley

Crispulo Estira Lictao, Jr

Julien Juéry

Lianjun Liu

Leo M Higgins, Iii

Andrew C McNeil

Hemant D Desai

Akhilesh Kumar Singh

Russell Joseph Lynch

Peter T Jones

Gary Carl Johnson

Walter Parmon

Colin Bryant Stevens

Russell S Shumway

Jose Fernandez Villasenor

Alexander M Arayata

Namrata Kanth

Dominic (PohMeng) Koey

James Lee Grothe

Pascal Oberndorff

A method of manufacturing a semiconductor device with an attached battery is provided. The method includes affixing a semiconductor die to a die pad region of a first battery lead of a leadframe. The first battery lead of the leadframe is separated from a second battery lead of the leadframe. An encapsulant encapsulates the semiconductor die and portions of the first and second battery leads of the leadframe. The battery is affixed to an exposed portion of the first battery lead of the leadframe such that a first terminal of the battery is conductively connected to the first battery lead. An exposed portion of the second battery lead of the leadframe is bent to overlap a top surface portion of the battery such that a second terminal of the battery conductively connected to the second battery lead.

Semiconductor device with attached battery and method therefor

A method of manufacturing a packaged semiconductor device is provided. The method includes affixing a sensor system to a die pad portion of a leadframe. A battery is affixed to the lead frame including a first terminal of the battery affixed to a first leg of the leadframe and a second terminal of the battery affixed to a second leg of the leadframe. An encapsulant encapsulates the sensor system, battery, and leadframe.

Semiconductor device with embedded battery and method therefor

A device package includes a die that includes a substrate having first and second surfaces. A sensor is formed at a sensor region of the first surface. A trench extends entirely through the substrate between the first and second surfaces, in which the trench at least partially surrounds the sensor region. An isolation material, formed at the first surface, may extend across the trench A ring structure is coupled to the first surface of the substrate to create a first cavity in which the sensor is contained, the ring structure being laterally displaced away from and surrounding the sensor region and the trench. A molded compound body may abut an outer wall of the ring structure. The molded compound body has a second cavity that is concentric with the first cavity to enable fluid communication between the sensor and an environment external to the device package.

Stress isolated device package and method of manufacture

A semiconductor device package having stress isolation is provided. The semiconductor device package includes a package substrate and a sensor attached to the package substrate. A first isolation material is formed around a perimeter of the sensor. An encapsulant encapsulates at least a portion of the first isolation material and the package substrate.

Semiconductor device package having stress isolation and method therefor

A no-gel sensor package is disclosed. In one embodiment, the package includes a microelectromechanical system (MEMS) die having a first substrate, which in turn includes a first surface on which is formed a MEMS device. The package also includes a polymer ring with an inner wall extending between first and second oppositely facing surfaces. The first surface of the polymer ring is bonded to the first surface of the first substrate to define a first cavity in which the MEMS device is contained. A molded compound body having a second cavity that is concentric with the first cavity, enables fluid communication between the MEMS device and an environment external to the package.

No-gel pressure sensor package

An electronic device package includes a first die coupled to a substrate, a second die coupled with the first die, and a spacer element coupled to the second die to form a stacked structure that includes the first die, the second die, and the spacer element. An electrically conductive shield overlies the stacked structure. The shield has a first end coupled to the spacer element and a second end coupled to the substrate. Inter-chip bond wires may electrically interconnect the first and second dies, and the shield may additionally overlie the bond wires. The spacer element may extend above a surface of the second die at a height that is sufficient to prevent the shield from touching the inter-chip bond wires.

Shielded electronic package and method of fabrication

A semiconductor device package that incorporates a waveguide usable for high frequency applications, such as radar and millimeter wave is provided. Embodiments employ a rigid-flex printed circuit board structure that can be folded to form the waveguide while, at the same time, mounting one or more semiconductor device die or packages. Embodiments reduce both the area of the mounted package and the distance signals need to travel between the semiconductor device die and antennas associated with the waveguide.

Method, system, and apparatus for forming three-dimensional semiconductor device package with waveguide

A semiconductor device includes a substrate, an IC die mounted on the substrate, packaging encapsulant on the substrate, a cavity in the packaging encapsulant, a conductive lid attached to the packaging encapsulant over the IC die, an electrical ground path in the substrate, and a first conductive structure in the cavity. The first conductive structure includes a first end electrically coupled to the conductive lid and a second end electrically coupled to the electrical ground path.

Grounding lids in integrated circuit devices

A method of manufacturing a packaged semiconductor device is provided. The method includes attaching a semiconductor die to a package substrate. A bond pad of the semiconductor die is coupled to an antenna radiator formed on the package substrate. A waveguide is attached to the package substrate. An opening of the waveguide includes sidewalls substantially surrounding the antenna radiator. An epoxy material is deposited over at least a portion of the package substrate while leaving the opening void of epoxy material.

Package integrated waveguide

Embodiments for a packaged semiconductor device and methods of making are provided herein, where a packaged semiconductor device includes a package body having a recess in which a pressure sensor is located; a polymeric gel within the recess that vertically and laterally surrounds the pressure sensor; and a media shield including at least one metal layer on a top surface of the polymeric gel, wherein the media shield and the polymeric gel are sufficiently flexible to transmit pressure to the pressure sensor.

Media shield with EMI capability for pressure sensor

A press-fit semiconductor device includes a lead frame having a die pad, leads with inner and outer lead ends, and a press-fit lead. The press-fit lead has a circular section between an outer lead end and an inner lead end, and the circular section has a central hole that is sized and shaped to receive a press-fit connection pin. A die is attached to the die pad and electrically connected to the inner lead ends of the leads and the inner lead end of the press-fit lead. The die, electrical connections and inner lead ends are covered with an encapsulant that forms a housing. The outer lead ends of the leads extend beyond the housing. The housing has a hole extending therethrough that is aligned with the center hole of the press-fit lead, so that a press-fit connection pin can be pushed through the hole to connect the device to a circuit board.

Press-fit semiconductor device

A packaged semiconductor device includes: a substrate; an semiconductor die attached to a top surface of the substrate; a mold body surrounding the semiconductor die; a tiered through mold via (TMV) comprising: a first recess having a recessed surface within the mold body at a first depth, and a second recess from the recessed surface to a second depth that exposes a ground contact area on a bonding area on the top surface of the substrate, wherein the first depth is greater than the second depth; and a metal shielding layer formed on a top surface of the mold body to form a shielded mold body, wherein the metal shielding layer makes direct contact with at least one sidewall of the first recess, with at least a portion of the recessed surface, with at least one sidewall of the second recess, and with the ground contact area.

High aspect ratio connection for EMI shielding

Microelectronic packages having hermetic cavities are provided, as are methods for producing such packages. In one embodiment, the microelectronic package includes a sensor die having first and second Microelectromechanical Systems (MEMS) transducer structures formed thereon. First and second cap pieces are coupled to the sensor die by, for example, direct or indirect bonding. A first hermetic cavity encloses the first MEMS transducer structure and is at least partially defined by the first cap piece and the sensor die. Similarly, a second hermetic cavity encloses the second MEMS transducer structure and at least partially defined by the second cap piece and the sensor die. A vent hole is fluidly coupled to the first hermetic cavity and is sealed by the second cap piece.

Microelectronic packages having hermetic cavities and methods for the production thereof

A sensor module, such as an acceleration sensor module, includes a leaded socket assembly covered by a housing. The leaded socket assembly includes a dual gauge lead frame, a sensor die, and various passive devices. The sensor die and the passive devices are mounted on the lead frame, and then the lead frame, sensor die, and passive devices are over-molded to form the leaded socket assembly. Neither the sensor module nor the socket assembly includes a printed circuit board, so many conventional sensor module assembly steps are bypassed.

Sensor module with blade insert

Growing community of inventors

Mesa, AZ, United States of America

Stephen Ryan Hooper