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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12589990 B1

PDFFull Text
Date of Patent:
Mar. 31, 2026

Filed:

Jun. 20, 2023

Die stacking with controlled tilt and angular alignment

Applicant:

Stmicroelectronics International N.v., Geneva, CH;

Inventors:

Chayathorn Saklang, Mesa, AZ (US);

Stephen Ryan Hooper, Queen Creek, AZ (US);

Dwight Lee Daniels, Phoenix, AZ (US);

Scott M Hayes, Chandler, AZ (US);

Jin Yang, North Plains, OR (US);

Assignee:

STMicroelectronics International N.V., Geneva, CH;

Attorney:

Seed Intellectual Property Law Group LLP

Primary Examiner:

Moazzam Hossain

Int. Cl.
CPC ...
B81C 1/00 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00269 (2013.01); B81B 7/0074 (2013.01); B81B 2207/99 (2013.01); B81C 2203/032 (2013.01); B81C 2203/054 (2013.01);
Abstract

Alignment features formed on a cover substrate allow for a second substrate to be bonded to the cover substrate while ensuring that the second substrate is not titled with respect to a plane defined by the alignment features. Die attachment material is patterned such that it deforms or flows underneath the second substrate while allowing corners of the second substrate to rest on landing areas that are elevated above the top surface of the cover substrate. Some of the landing areas may include additional features that are elevated above the landing areas to form notches which constrain the rotational position of the second in addition to its tilt.

Find Patent Forward Citations

Saklang, Chayathorn. (2026). Die stacking with controlled tilt and angular alignment (U.S. Patent No. 12589990). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12589990

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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