The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2021
Filed:
Apr. 05, 2019
Applicant:
Nxp Usa, Inc., Austin, TX (US);
Inventors:
Stephen Ryan Hooper, Mesa, AZ (US);
Dwight Lee Daniels, Phoenix, AZ (US);
Thomas Cobb Speight, Chandler, AZ (US);
Gary Carl Johnson, Tempe, AZ (US);
Assignee:
NXP USA, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); G01L 9/12 (2006.01); H01L 23/495 (2006.01); G01L 9/06 (2006.01); H01L 21/56 (2006.01); H01L 21/02 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); G01L 9/06 (2013.01); G01L 9/12 (2013.01); H01L 21/02631 (2013.01); H01L 21/565 (2013.01); H01L 23/4952 (2013.01); H01L 23/562 (2013.01);
Abstract
Embodiments for a packaged semiconductor device and methods of making are provided herein, where a packaged semiconductor device includes a package body having a recess in which a pressure sensor is located; a polymeric gel within the recess that vertically and laterally surrounds the pressure sensor; and a media shield including at least one metal layer on a top surface of the polymeric gel, wherein the media shield and the polymeric gel are sufficiently flexible to transmit pressure to the pressure sensor.