The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2022
Filed:
Jul. 29, 2019
Applicant:
Nxp Usa, Inc., Austin, TX (US);
Inventors:
Michael B. Vincent, Chandler, AZ (US);
Scott M. Hayes, Chandler, AZ (US);
Zhiwei Gong, Chandler, AZ (US);
Stephen Ryan Hooper, Chandler, AZ (US);
Assignee:
NXP USA, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01Q 1/22 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/4846 (2013.01); H01L 23/5386 (2013.01); H01L 23/5387 (2013.01); H01L 23/5389 (2013.01); H01L 24/20 (2013.01); H01Q 1/2283 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/214 (2013.01);
Abstract
A semiconductor device package that incorporates a waveguide usable for high frequency applications, such as radar and millimeter wave is provided. Embodiments employ a rigid-flex printed circuit board structure that can be folded to form the waveguide while, at the same time, mounting one or more semiconductor device die or packages. Embodiments reduce both the area of the mounted package and the distance signals need to travel between the semiconductor device die and antennas associated with the waveguide.