The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2025
Filed:
Apr. 26, 2022
Applicant:
Nxp Usa, Inc., Austin, TX (US);
Inventors:
Stephen Ryan Hooper, Queen Creek, AZ (US);
Chanon Suwankasab, Pathumthani, TH;
Chayathorn Saklang, Bangplee, TH;
Crispulo Estira Lictao, Jr., Binan, PH;
Amornthep Saiyajitara, Bangken, TH;
Dominic (pohmeng) Koey, Shah Alam, MY;
Assignee:
NXP USA, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H02J 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/49503 (2013.01); H01L 23/49593 (2013.01); H01L 24/48 (2013.01); H02J 7/0063 (2013.01); H01L 2224/48221 (2013.01);
Abstract
A method of manufacturing a packaged semiconductor device is provided. The method includes affixing a sensor system to a die pad portion of a leadframe. A battery is affixed to the lead frame including a first terminal of the battery affixed to a first leg of the leadframe and a second terminal of the battery affixed to a second leg of the leadframe. An encapsulant encapsulates the sensor system, battery, and leadframe.