The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2016
Filed:
Apr. 27, 2015
Freescale Semiconductor, Inc., Austin, TX (US);
Dwight L. Daniels, Phoenix, AZ (US);
Stephen R. Hooper, Mesa, AZ (US);
Alan J. Magnus, Gilbert, AZ (US);
Justin E. Poarch, Gilbert, AZ (US);
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Abstract
A structure to improve saw singulation quality and wettability of integrated circuit packages () is assembled with lead frames () having half-etched recesses () in leads. In one embodiment, the structure is a lead frame strip () having a plurality of lead frames. Each of the lead frames includes a depression () that is at least partially filled with a material () prior to singulating the lead frame strip. In another embodiment, the structure is a semiconductor device package () that includes a semiconductor device encapsulated in a package body () having a plurality of leads (). Each lead has an exposed portion external to the package. There is recess () at a corner of each lead. Each recess has a generally concave configuration. Each recess is filled with a removable material ().