The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2019
Filed:
Sep. 12, 2017
Applicant:
Nxp Usa, Inc., Austin, TX (US);
Inventors:
Assignee:
NXP USA, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/62 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); G01L 9/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); G01L 9/00 (2013.01); H01L 23/49517 (2013.01); H01L 23/49531 (2013.01); H01L 23/49548 (2013.01); H01L 23/49582 (2013.01); H01L 24/17 (2013.01); H01L 24/48 (2013.01); H01L 2224/48247 (2013.01);
Abstract
Embodiments of a packaged semiconductor device are provided, which includes a flag of a lead frame having a top surface and a bottom surface; a redistribution layer (RDL) structure formed on the top surface of the flag, the RDL structure including a first connection path having a first exposed bonding surface in a top surface of the RDL structure; and a first wirebond connected to the first exposed bonding surface and to a lead of the lead frame.