Company Filing History:
Years Active: 2019
Title: Ryan Hooper: Innovator in Semiconductor Technology
Introduction
Ryan Hooper is a notable inventor based in Tempe, Arizona. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent.
Latest Patents
Ryan Hooper holds a patent for a lead frame having a redistribution layer. This invention includes a packaged semiconductor device that features a flag of a lead frame with a top surface and a bottom surface. The design incorporates a redistribution layer (RDL) structure formed on the top surface of the flag. The RDL structure includes a first connection path with an exposed bonding surface, which is essential for connecting wirebonds to the lead frame.
Career Highlights
Ryan is currently employed at NXP USA, Inc., where he continues to develop cutting-edge technologies in the semiconductor industry. His work has been instrumental in advancing the capabilities of packaged semiconductor devices.
Collaborations
Ryan collaborates with talented individuals such as Michael B. Vincent and Dwight Lee Daniels, contributing to a dynamic work environment that fosters innovation.
Conclusion
Ryan Hooper's contributions to semiconductor technology through his patent and work at NXP USA, Inc. highlight his role as an influential inventor in the industry. His innovative spirit continues to drive advancements in technology.